Polishing apparatus
AssigneeMurata Manufacturing Co., Ltd.
InventorsToru Nishikawa, Takeshi Inao
Life of this patent
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Abstract
A polishing apparatus is provided for accurately detecting the relative displacement between an upper wheel and a lower wheel and thus for reliably polishing workpieces to a desired thickness. The polishing apparatus includes an upper wheel for pressing at least one workpiece, a lower wheel for supporting the workpiece, non-contact-type displacement-detection device for detecting the relative displacement between the upper wheel and the lower wheel, and a reference table for providing a displacement-detection reference position. The non-contact-type displacement-detection device is joined to the upper wheel so as to move therewith. The reference table is disposed at a position opposing the displacement-detection device and also is integrally connected to the lower wheel.
Claims3
A polishing apparatus, comprising:
- an upper wheel for pressing at least one workpiece to be polished;
- a lower wheel for supporting the at least one workpiece;
- displacement-detection means, joined to the upper wheel to move together therewith, for detecting relative displacement between the upper wheel and the lower wheel;
- and
- a reference table arranged at a position opposing the displacement-detection means and integrally fixed to the lower wheel through a connecting arm, the reference table providing a displacement-detection reference position,
- wherein the at least one workpiece is polished by a relative difference in speeds between the at least one workpiece and at least one of the lower wheel and the upper wheel.
Dependencies are inferred from the claim text.