Technique for protecting photonic devices in optoelectronic packages with clear overmolding

An optoelectronic package comprising:

• a substrate having at least one electrically conductive trace thereon;
• a photonic device carried by the base substrate, the photonic device having an active facet and at least one bond pad thereon;
• at least one reverse bonded bonding wire, each reverse bonded bonding wire being ball bonded to an associated conductive trace on the substrate and stitch bonded to an associated bond pad;
• an optical fiber in optical communication with the facet on the photonic device;
• and
• an optically clear cap that is molded over the photonic device to cover the photonic device and the bonding wire, wherein the cap has a top surface with a slanted orientation having a raised end and a lower end and wherein the optical fiber registers against the raised end of the cap such that a face surface of the optical fiber is oriented at an angle to the top surface of the cap, whereby the cap defines a desired standoff distance between the optical fiber and the active facet of the photonic device.

An optoelectronic package comprising:

• a flexible base substrate having at least one electrically conductive trace thereon,
• an optical component support block that supports the flexible base substrate;
• a photonic device mounted on the base substrate, the photonic device having an active facet thereon;
• an optical fiber having a substantially flat end face, the fiber in optical communication with the facet on the photonic device;
• and
• an optically clear cap that is molded over the photonic device to cover the photonic device and the bonding wire, the optically clear cap having a substantially flat top surface face arranged at an angle to the end face of the fiber, wherein the optical fiber registers against the cap, whereby the cap defines a desired standoff distance between the optical fiber and the active facet of the photonic device.