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US 7,000,822 B2Granted
Wire bond integrity test system
AssigneeTexas Instruments Incorporated
InventorsAllan I. Dacanay, Raymond M. Partosa, Enrique R. Ferrer
Life of this patent
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Abstract
An improved bond integrity test system is provided by eliminating the spring loaded wire spool cover which contributes to particulate matter, and by addition of a second contact diverter in the wire path. These improvements have been shown to decrease false lifted ball bond reports by 68%, and therefore to improve productivity and accuracy of the test system. Such changes are readily adapted to current bonders, as well as to new designs.
Claims6
An improved bonder system for automated ball-bond integrity testing comprising:
- a wire spool,
- a first contact diverter and a second contact diverter;
- a capillary;
- a gold wire wound on the wire spool, contacting the first contact diverter and the second contact diverter, and through the capillary.
1 more element
Dependencies are inferred from the claim text.