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US 7,000,821 B2Granted
Method and apparatus for improving an integrated circuit device
AssigneeIntel Corporation
InventorsTerry Sterrett, Tim Chen
Life of this patent
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Abstract
A method and apparatus provides increased operative life for flip-chip devices that are produced from an integrated circuit formed with electrically conductive bumps bonded to a printed circuit board substrate. The bumps and the substrate are formed from similar materials that allow control of the degree of latency for each element and produce a covalently bonded laminate structure when the bumps and substrate are brought together. The covalently bonded structure decreases bump fatigue to lengthen the operative life of the flip-chip device.
Claims7
A method, comprising:
- forming a conductive bump on one of a die and a substrate;
- forming a non-conductive pocket on the other of said die and substrate;
- and
- contacting the bump with the non-conductive pocket;
- and
- curing the bump and the non-conductive pocket to form a covalently bonded laminate structure.
3 more elements
A method for making a flip chip, comprising:
- forming a plurality of electrically conductive polymer bumps on one of a die and a substrate;
- forming an electrically non-conductive film around each of a plurality of contact pads on other of said die and substrate;
- partially curing the bumps and the film;
- and
- contacting the bumps with the contact pads, and curing the bumps and the non-conductive film to form a covalently bonded laminate structure.
2 more elements
Dependencies are inferred from the claim text.