Plasma surface treatment system and plasma surface treatment method
AssigneeSony Corporation
InventorsSeiichi Fukuda, Seiji Samukawa
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Abstract
A plasma surface treatment system for irradiating a surface of a substrate to be treated with a nitrogen plasma excited by a high-frequency electric field to introduce nitrogen into the surface of the substrate comprises a pulse modulator for pulse modulation of the high-frequency electric field. By applying the high-frequency electric field in a pulsed form, it is possible to realize a nitriding by which the peak of nitrogen concentration is located at a shallower position and a desired nitrogen concentration can be obtained.
Claims8
A plasma surface treatment system for irradiating a surface of a substrate to be treated with a nitrogen plasma excited by a high-frequency electric field to introduce nitrogen into said surface of said substrate, wherein
- said system comprises a pulse modulator for pulse modulation of said high-frequency electric field, wherein said pulse modulator is a pulse modulator capable of controlling the high-frequency electric field application time at the time of pulse modulation of said high-frequency electric field.
A plasma surface treatment method for irradiating a surface of a substrate to be treated with a nitrogen plasma excited by a high-frequency electric field to introduce nitrogen into said surface of said substrate, wherein
- a high-frequency electric field undergoing pulse modulation is used as said high-frequency electric field, wherein the high-frequency electric field application time is controlled at the time of pulse modulation of said high-frequency electric field.
Dependencies are inferred from the claim text.