Stencil and apparatus for supporting and tensioning the stencil
AssigneeAlpha Fry Limited
InventorDavid Godfrey Williams
Life of this patent
Estimating the term…
Abstract
A support and tensioning frame for a stencil to enable solder paste to be applied to printed circuit boards and other electronic substrates includes a support frame engaged with at least two opposed mounting members. Each mounting member includes at least one projection for engaging an aperture in a stencil to mount the stencil under tension. A permanent-biasing mechanism engages one or more of the mounting members to place the stencil under tension. A second biasing mechanism engages the mounting member to provide a bias opposite that of the permanent-biasing mechanism to facilitate release of a mounted stencil.
Claims20
An apparatus for printing materials onto surface contacts on an electronic substrate, the apparatus comprising:
- a stencil comprising a metallic sheet having one or more apertures formed through the thickness of the metallic sheet to define a pattern for printing solder on a substrate, the metallic sheet having four peripheral edges, and the metallic sheet defining more than two slots along each peripheral edge;
- a support frame having four side members with each side member connected to two other side members and including a channel that extends along each side member;
- at least first and second displaceable opposed mounting members, with each mounting member disposed within the channel and including a mounting plate that carries a plurality of projections extending from the mounting plate to comprise a terminal side edge, the projections configured to engage the slots along a peripheral edge of the metallic sheet;
- a mechanism to bias the first mounting member away from the second opposing mounting member;
- and
- an inflatable tubular member disposed within the channel and extending along the four side members to displace the first mounting member toward the second opposing mounting member when the tubular member is inflated.
An apparatus for supporting and tensioning a stencil to enable solder printing of circuit boards and other electronic substrates, comprising:
- a support frame having four side members with each side member connected to two other side members and including a channel that extends along each side member;
- at least first and second displaceable opposed mounting members with each mounting bar disposed within the channel;
- a mechanism to bias the at least first mounting bar away from the at least second opposing mounting bar;
- and
- an inflatable tubular member disposed within the channel and extending along the four side members to displace the at least first mounting bar toward the at least second opposing mounting bar when the tubular member is inflated.
Dependencies are inferred from the claim text.