Conductor board and method for producing a conductor board
AssigneeCuramik Electronics GmbH
InventorsJurgen Schulz-Harder, Andreas Meyer
Life of this patent
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Abstract
The conductor board has at least one layer of a dielectric provided areally on two mutually opposed faces with at least one metalization on each. There is at least one through contacting in the region of an aperture. The metalizations are applied to cover at least one aperture and are electrically connected to each other through the aperture.
Claims18
A method for producing a conductor board or print board having at least one ceramic layer (2) with at least one aperture (6) there through, at least two metal layers (3, 4), one on each side of said ceramic layer (2), and an electrical through contact (5, 5a, 5b) in said at least one aperture (6), said method comprising:
- (a) applying one of each of said metal layers (3, 4) on each side of said ceramic layer (2) by a direct copper bonding technique or by an active soldering technique, such that said metal layers (3, 4) cover said aperture (6) on each side of said ceramic layer (2);
- (b) permanently deforming one of said metal layers (3) into said aperture (6) by means of a stamp (7, 7a, 7b) while supporting the other of said metal layers (4) on a rest (10) such that a cone shaped segment (3′, 3a′, 3b′) is formed in said aperture;
- and
- (c) connecting said segment (3′, 3a′, 3b′) to said other of said metal layers (4) by electrical welding, with the stamp (7, 7a, 7b) and the rest (10) being used as welding electrodes, in order to form said electrical contact (5, 5a, 5b) and produce said conductor board.
A method for producing a conductor board comprising:
- (a) inserting a body (9) of electrically conductive material into an aperture (6) of a dielectric layer (2), said body (9) having a height (h) smaller than the thickness (dc) of layer (2);
- (b) applying one of each of two metalization (3, 4) on two mutually opposed faces of said dielectric layer (2) by a direct copper bonding technique or an active soldering technique such that said aperture (6) is covered by said metalizations (3, 4);
- (c) deforming at least one of said metalizations (3, 4) so that both of said metalizations (3, 4) contact body (9);
- (d) electrically connecting said body (9) to both said metalizations (3, 4).
Dependencies are inferred from the claim text.