Process for fabricating circuit assemblies using electrodepositable dielectric coating compositions

A process for fabricating a circuit assembly comprising the following steps:

• (I) providing an electroconductive core
• (II) applying electrophoretically an electrodoepositable coating composition onto all exposed surfaces of the core to form a conformal dielectric coating thereon,
• said electrodepositable coating composition comprising a resinous phase dispersed in an aqueous phase, said resinous phase comprising:
• (a) an ungelled, active hydrogen-containing, ionic salt group-containing resin;
• and
• (b) a curing agent reactive with the active hydrogens of the resin (a),
• said resinous phase having a covalently bonded halogen content of at least 1 percent by weight based on total weight of resin solids present in said resinous phase;
• (III) ablating a surface of the conformal dielectric coating in a predetermined pattern to expose a section of the core;
• (IV) applying a layer of metal to all surfaces to form metallized vias in the core;
• and
• (V) applying a resinous photosensitive layer to the metal layer.

A process for fabricating a circuit assembly comprising the following steps:

• (I) providing an electroconductive core;
• (II) providing a photoresist at predetermined locations on the surface of the core;
• (III) applying electrophoretically an electrodepositable coating composition over the core of step (II), wherein said coating composition is deposited electrophoretically over all surfaces of the core except at the locations having the photoresist thereon,
• said electrodepositable coating composition comprising a resinous phase dispersed in an aqueous phase, said resinous phase comprising:
• (a) an ungelled, active hydrogen-containing, ionic salt group-containing resin;
• and
• (b) a curing agent reactive with the active hydrogens of the resin (a),
• said resinous phase having a covalently bonded halogen content of at least 1 percent by weight based on total weight of resin solids present in said resinous phase;
• (IV) curing the electrophoretically applied coating composition to form a cured conformal dielectric layer over all surfaces of the core except at the locations having the photoresist thereon;
• (V) removing said photoresist to form a circuit assembly having vias extending to said core at the locations previously covered with said resist;
• and
• (VI) optionally, applying a layer of metal to all surfaces of the circuit assembly of step (V) to form metallized vias extending to said core.