Circuit-substrate working system and electronic-circuit fabricating process

A process of mounting electronic components on circuit substrates, to fabricate electronic circuits, by using a circuit-substrate working system including (a) at least one electronic-component mounting machine each operable to mount the electronic components on the circuit substrates and to transmit object information relating to at least one monitoring-object portion thereof to be monitored, (b) at least one result-detecting device each operable to detect a result of an operation of said at least one electronic-component mounting machine to mount said electronic components, and (c) a monitoring device operable on the basis of the result detected by said each result-detecting device and said object information received from said at least one electronic-component mounting machine, to estimate a state of each of said at least one monitoring-object portion,

• wherein said at least one result-detecting device includes a detecting machine disposed downstream of a corresponding one of said at least one electronic-component mounting machine and operable after said plurality of electronic components have been mounted on one circuit substrate by said corresponding one electronic-component mounting machine, to effect at least one of detection as to whether each of at least one of the electronic components is present or absent at a predetermined mounting spot on said circuit substrate, and detection of mounting-position errors of at least one of the electronic components as mounted on said circuit substrate, the electronic circuits being fabricated while the state of said at least one electronic-component mounting machine is monitored by said monitoring device on the basis of the result detected by said detecting machine and said object information.

A process of mounting electronic components on circuit substrates, to fabricate electronic circuits, by using a circuit-substrate working system including (a) at least one electronic-component mounting machine each operable to mount the electronic components on the circuit substrates and to transmit object information relating to at least one monitoring-object portion thereof to be monitored, (b) at least one result-detecting device each operable to detect a result of an operation of said at least one electronic-component mounting machine to mount said electronic components, and (c) a monitoring device operable on the basis of the result detected by said each result-detecting device and said object information received from said at least one electronic-component mounting machine, to estimate a state of each of said at least one monitoring-object portion,

• wherein said at least one result-detecting device includes a detecting device incorporated in a corresponding one of said at least one electronic-component mounting machine and operable after said plurality of electronic components have been mounted on one circuit substrate by said corresponding one electronic-component mounting machine, to effect at least one of detection as to whether each of at least one of the electronic components is present or absent at a predetermined mounting spot on said circuit substrate, and detection of mounting-position errors of at least one of the electronic components as mounted on said circuit substrate, the electronic circuits being fabricated while the state of said at least one electronic-component mounting machine is monitored by said monitoring device on the basis of the result detected by said detecting device and said object information.

A process of mounting electronic components on circuit substrates, to fabricate electronic circuits, by using a circuit-substrate working system including (a) at least one electronic-component mounting machine each operable to mount the electronic components on the circuit substrates and to transmit object information relating to at least one monitoring-object portion thereof to be monitored, (b) at least one result-detecting device each operable to detect a result of an operation of said at least one electronic-component mounting machine to mount said electronic components, and (c) a monitoring device operable on the basis of the result detected by said each result-detecting device and said object information received from said at least one electronic-component mounting machine, to estimate a state of each of said at least one monitoring-object portion,

• wherein said at least one result-detecting device includes a detecting device incorporated in a corresponding one of said at least one electronic-component mounting machine and operable during mounting of said plurality of electronic components on one circuit substrate by said corresponding one electronic-component mounting machine, to effect at least one of detection as to whether each of at least one of the electronic components is present or absent at a predetermined mounting spot on said circuit substrate, and detection of mounting-position errors of at least one of the electronic components as mounted on said circuit substrate, the electronic circuits being fabricated while the state of said at least one electronic-component mounting machine is monitored by said monitoring device on the basis of the result detected by said detecting device and said object information are fabricated.