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US 6,998,358 B2Granted
Method for providing nano-structures of uniform length
AssigneeE.I. du Pont de Nemours and Company
InventorsRoger Harquail French, Timothy Gierke, Mark Andrew Harmer, Anand Jagota, Steven Raymond Lustig, Rakesh H. Mehta, Paula Beyer Hietpas, Bibiana Onoa
Life of this patent
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Abstract
This invention relates to the field of nanotechnology. Specifically the invention describes a method for cutting a multiplicity of nano-structures to uniform dimensions of length, length and width, or area, or to a specific distribution of lengths or area using various cutting techniques.
Claims9
A method for cutting a population of nano-structures to a uniform length or distribution of lengths comprising:
- a) coating a population of nano-structures on a solid substrate wherein the nano-structures are spatially fixed on the surface of the substrate;
- b) identifying discrete portions of the coated nano-structures of step (a) according to a patterning system;
- and
- c) applying a cutting means the identified discrete portions of the nano-structures of step (b) whereby the nano-structures are cut to a uniform length or distribution of lengths;
- wherein the nano-structures have a defined shape selected from the group consisting of tubes, rods, cylinders, bundles, wafers, disks, sheets, plates, planes, cones, slivers, granules, ellipsoids, wedges, and fibers.
2 more elements
Dependencies are inferred from the claim text.