Semiconductor device
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsKenya Yamashita, Makoto Kitabatake, Osamu Kusumoto, Kunimasa Takahashi, Masao Uchida, Ryoko Miyanaga
Life of this patent
Estimating the term…
Loading patent…
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsKenya Yamashita, Makoto Kitabatake, Osamu Kusumoto, Kunimasa Takahashi, Masao Uchida, Ryoko Miyanaga
Estimating the term…
A semiconductor device having an accumulation channel SiC-MISFET structure includes a p-type SiC layer 10 formed on an SiC substrate, an n-type channel layer 20, a gate insulating film 11, a gate electrode 12, and n-type source and drain layers 13a and 13b. The channel layer 20 includes an undoped layer 22 and a δ doped layer 21 which is formed in the vicinity of the lower end of the undoped layer 22. Since the channel layer 20 includes the high-concentration δ doped layer 21 in its deeper portion, the electric field in the surface region of the channel layer is weakened, thereby allowing the current driving force to increase.
A semiconductor device comprising:
Dependencies are inferred from the claim text.