Method for using a blade assembly cover
AssigneeMicron Technology, Inc.
InventorErnest J. Hamilton
Life of this patent
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Abstract
A gang blade assembly which controls the trajectory of detritus from a ball grid array substrate dicing operation is described. The assembly includes a cover which partially encases a hub with a plurality of blades. A brush is mounted on the cover to disrupt an air flow created by rotation of the hub and blades. The brush extends beneath the cover and has bristles which contact the hub. The bristles also serve to clear the hub of any detritus produced during dicing. More than one brush may be mounted on the cover.
Claims11
A method of cutting a substrate, said method comprising:
- placing a protective cover at least partially around a periphery of a blade assembly that includes a hub and at least one blade;
- providing a brush in contact with said at least one blade and said hub;
- rotating the hub and the at least one blade;
- and
- cutting a substrate with said at least one rotating blade.
A method of controlling the trajectory of detritus during a substrate dicing operation, said method comprising:
- placing a protective cover at least partially around the periphery of a blade assembly that includes a hub and at least one blade;
- mounting a brush on a flange of the protective cover, the brush being in contact with the hub;
- rotating the hub and the at least one blade;
- dicing a ball grid array substrate with the rotating blade, said dicing producing detritus;
- and
- disrupting an air flow path caused by said rotating step with said brush.
Dependencies are inferred from the claim text.