Method and apparatus for flexible fluid delivery for cooling desired hot spots in a heat producing device

An electronic device comprising:

• a. an integrated circuit;
• b. an interface layer integrally formed with the integrated circuit and configured to pass fluid therethrough;
• and
• c. a manifold layer for circulating fluid with the interface layer, wherein the manifold layer is configured to selectively cool at least one interface hot spot region and to provide a greater flow rate of fluid to the at least one interface hot spot region than to cooler interface regions.

An electronic device comprising:

• a. an integrated circuit;
• b. an interface layer integrally formed with the integrated circuit and configured to pass fluid therethrough;
• and
• c. a manifold layer for circulating fluid with the interface layer, wherein the manifold layer includes a plurality of fingers configured to minimize pressure drop within the electronic device and to provide a greater flow rate of fluid to at least one interface hot spot region in the integrated circuit than to cooler interface regions in the integrated circuit.

A method of manufacturing an electronic device comprising the steps of:

• a. providing an integrated circuit;
• b. forming an interface layer integrally with the integrated circuit, the interface layer capable of absorbing heat generated from the integrated circuit and capable of passing fluid therethrough;
• and
• c. forming a manifold layer to the interface layer, the manifold layer configurable to circulate fluid with the interface layer, to minimize pressure drop within the electronic device, and to provide a greater flow rate of fluid to at least one interface hot spot region in the integrated circuit than to cooler interface regions in the integrated circuit.

A closed loop system for cooling at least one integrated circuit comprising:

• a. at least one heat exchanger for absorbing heat generated by the integrated circuit, the heat exchanger further comprising:
• i. an interface layer in contact with the integrated circuit and configured to pass fluid therethrough;
• and
• ii. a manifold layer coupled to the interface layer, the manifold layer adapted to circulate fluid with the interface layer, to minimize pressure drop within the heat exchanger, and to provide a greater flow rate of fluid to at least one interface hot spot region in the integrated circuit than to cooler interface regions in the integrated circuit;
• b. at least one pump for circulating fluid throughout the loop, the pump coupled to the at least one heat exchanger;
• and
• c. at least one heat rejector coupled to the pump and the heat exchanger, the heat rejector fo cooling heated liquid output from the heat exchanger.