Interwoven manifolds for pressure drop reduction in microchannel heat exchangers

An electronic device comprising:

• a. an integrated circuit;
• b. an interface layer integrally formed with the integrated circuit and configured to pass fluid therethrough, wherein the interface layer includes a micro-porous structure disposed thereon;
• and
• c. a manifold layer for circulating fluid with the interface layer, the manifold layer having a first set fingers and a second set of fingers, wherein the first set of fingers are disposed in parallel with the second set of fingers and arranged to reduce pressure drop within the electronic device by reducing a length traveled by the fluid along the interface layer.

An electronic device comprising:

• a. an integrated circuit;
• b. a manifold layer including a first set of fingers in a first configuration, wherein each finger in the first set channels fluid at a first temperature, the manifold layer further including a second set of fingers in a second configuration, wherein each finger in the second set channels fluid at a second temperature, the first set and second set of fingers arranged parallel to each other and also arranged to reduce fluid pressure drop by reducing a length traveled by the fluid along an interface layer;
• and
• c. the interface layer in contact with the integrated circuit, the interface layer configured to receive fluid at the first temperature at a plurality of first locations, wherein each first location is associated with a corresponding finger in the first set, the interface layer passing fluid along a plurality of predetermined paths to a plurality of second locations, wherein each second location is associated with a corresponding finger in the second set.

A closed loop system for cooling at least one integrated circuit comprising:

• a. at least one heat exchanger for absorbing heat generated by the integrated circuit, the heat exchanger further comprising:
• i. an interface layer in contact with the integrated circuit and configured to pass fluid therethrough, wherein the interface layer includes a micro-porous structure disposed thereon;
• and
• ii. a manifold layer coupled to the interface layer, the manifold layer having a first set fingers and a second set of fingers, wherein the first set of fingers are disposed in parallel with the second set of fingers and arranged to reduce pressure drop within the heat exchanger by reducing a length traveled by the fluid along the interface layer;
• b. at least one pump for circulating fluid throughout the loop, the pump coupled to the at least one heat exchanger;
• and
• c. at least one heat rejector coupled to the pump and the heat exchanger, the heat rejector for cooling heated liquid output from the heat exchanger.

A method of cooling a heat source, the method comprising:

• a. providing fluid at a first temperature to a heat exchange region via a first set of fingers in a first configuration;
• b. channeling the fluid along a plurality of flow paths along the heat exchange region, wherein the fluid is channeled to a second set of fingers in a second configuration, wherein the first and second configuration are arranged in parallel to minimize pressure drop there between by reducing a length traveled by the fluid along the heat exchange region;
• and
• c. removing fluid at a second temperature from the heat exchange region via the second set of fingers.