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US 6,984,446 B2Granted
Process for producing a metal layer on a substrate body, and substrate body having a metal layer
AssigneeInfineon Technologies AG
InventorsHarald Gundlach, Andreas Muller-Hipper, Ewald Simmerlein-Erlbacher
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Abstract
Process for producing a metal layer on a substrate body. The process includes applying conductive particles to a surface of the substrate body, so that the conductive particles are fixed to the substrate body, and metallizing the substrate body together with the particles chemically and/or by electrodeposition in a metallization bath so as to form the metal layer.
Claims12
A process for producing a metal layer on a substrate body, comprising the steps of:
- discharging the substrate body, which consists of a plastic, from an extruder,
- applying conductive particles to a surface of the substrate body by covering the surface with the conductive particles once the substrate body emerges from the extruder, without a carrier material in which the particles are embedded, so that the conductive particles are fixed to the substrate body;
- and
- metallizing the substrate body together with the particles chemically and/or by electrodeposition in a metallization bath so as to form the metal layer.
1 more element
A device comprising:
- a substrate body, which consists of plastic and is discharged from an extruder;
- a metal layer applied to a surface of the substrate body;
- conductive particles provided between the metal layer and the surface of the substrate body,
- wherein the conductive particles are arranged directly on the substrate body, without a carrier material in which the particles are embedded, by covering the surface of the substrate body once the substrate body emerges from the extruder.
1 more element
A device comprising:
- a substrate body, which consists of plastic and is discharged from an extruder;
- a particle layer formed by conductive particles on each of two opposite surfaces of the substrate body, wherein the conductive particles are arranged directly on the substrate body, without a carrier material in which they are embedded, by covering the surfaces of the substrate body once the substrate body emerges from the extruder
- a metal layer formed on each of the particle layers;
- and
- an opening, which passes through the substrate body, formed in a region of the particle layers, wherein at least walls of the opening are lined with a conductive layer which is in electrical contact with each of the metal layers on the surfaces of the substrate body,
- wherein the conductive layer is formed by electrodeposition in a same process step as the metal layers.
3 more elements
Dependencies are inferred from the claim text.