US 6,980,418 B1 · Method and apparatus for controlling the temperature of electronic device enclosures

Abstract

An electronic device housing comprising a device enclosure with electronic components mounted inside the enclosure is disclosed. Mounted between the electronic device housing and the device enclosure is a thermally reflective electrical insulator configured to reduce external heating of the enclosure by the electronic components contained therein. Such an arrangement reflects heat generated by internal electronic components back inside the device enclosure, thereby reducing the external temperature of the electronic device housing. The electronic device housing, for example, pertains to a portable computer. Additionally, a method for reducing the external temperature of a computer housing for a portable computer is disclosed.

Claims13

Dependent claims

An electronic device housing comprising:

a device enclosure;
an electronic component mounted inside the enclosure;
and
a thermally reflective structure arranged between the electronic component and the enclosure to reduce enclosure heating by the electronic component wherein the thermally reflective electrical structure comprises a layered structure having an electrically insulating thermally transmissive first layer and a thermally reflective second layer arranged such that the first layer is positioned between the electronic component and the second layer, and the second layer is positioned between first layer and an inner surface of the enclosure.

1 more element

Dependencies are inferred from the claim text.

Method and apparatus for controlling the temperature of electronic device enclosures

Life of this patent

Method and apparatus for controlling the temperature of electronic device enclosures

Life of this patent

Abstract

Claims13