Thermal apparatus for engaging electronic device

An apparatus for controlling the temperature of a plurality of electronic devices, said apparatus comprising:

• a plurality of thermal heads;
• a base structure having a plurality of planar springs supporting respective of said thermal heads;
• and
• each of said planar springs being movable to facilitate movement of a respective thermal head into engagement with a corresponding said electronic device,
• wherein said base structure comprises configured slots so as to form said planar springs.

An apparatus comprising:

• a generally planar base structure defining a mount portion to which a thermal head is mounted, said mount portion being supported by an isolation arrangement;
• said isolation arrangement being configured to permit movement of said thermal head between retracted and extended positions;
• and
• said isolation arrangement being formed by configured slots in said base structure so as to form a planar spring in said mount portion.

An apparatus comprising:

• a generally planar base structure defining a mount portion to which a thermal head is mounted, said mount portion being supported by an isolation arrangement;
• said isolation arrangement being configured to permit movement of said thermal head between retracted and extended positions;
• and
• said isolation arrangement including at least one flexible arm defining a flow passage for conducting refrigerant fluid,
• wherein said base structure comprises at least one configured slot so as to form a planar spring in said mount portion.