Semiconductor device method of manufacturing
AssigneeSemiconductor Energy Laboratory Co., Ltd.
InventorsHisashi Ohtani, Tamae Takano, Chiho Kokubo
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Abstract
To effectively crystallize an amorphous semiconductor film comprising silicon by utilizing nickel element and remove nickel element contributed to the crystallization, a mask 103 is provided on an amorphous silicon film 102, oxide film patterns 107 and 108 including nickel are formed, phosphorus is doped in a region 109, thereafter, heating is performed, nickel element is diffused via paths 110 and 111 and nickel element diffuses in the amorphous silicon film and gettered by phosphorus at the region 109 by which crystallization of diffusion of nickel and gettering of nickel can be carried out simultaneously.
Claims20
A method of manufacturing a semiconductor device comprising:
- forming an amorphous film comprising silicon and germanium;
- providing said amorphous film with a material comprising a metal for promoting crystallization of said amorphous film;
- heating said amorphous film provided with said material to crystallize said amorphous film, thereby, forming a crystallized film;
- removing said material from the crystallized film by gettering.
A method of manufacturing a semiconductor device comprising:
- forming an amorphous film comprising silicon and germanium;
- providing a selected portion of said amorphous film with a material comprising a metal for promoting crystallization of said amorphous film;
- heating said amorphous film provided with said material to crystallize said amorphous film, thereby, forming a crystallized film wherein crystallization proceeds laterally from said selected to a portion;
- removing said material from the crystallized film by gettering.
A method of manufacturing a semiconductor device comprising:
- forming an amorphous film comprising silicon and germanium;
- providing said amorphous film with a material comprising a metal for promoting crystallization of said amorphous film;
- heating said amorphous film provided with said material to crystallize said amorphous film, thereby, forming a crystallized film;
- removing said material from the crystallized film by gettering;
- patterning said crystallized film to form at least one semiconductor island;
- and
- forming a gate electrode adjacent to the semiconductor island with a gate insulating film interposed therebetween.
A method of manufacturing a semiconductor device comprising:
- forming an amorphous film comprising silicon and germanium;
- providing a selected portion of said amorphous film with a material comprising a metal for promoting crystallization of said amorphous film;
- heating said amorphous film provided with said material to crystallize said amorphous film, thereby, forming a crystallized film wherein crystallization proceeds laterally from said selected to a portion;
- removing said material from the crystallized film by gettering;
- patterning said crystallized film to form at least one semiconductor island;
- and
- forming a gate electrode adjacent to the semiconductor island with a gate insulating film interposed therebetween.
Dependencies are inferred from the claim text.