Apparatus and method for terminating probe apparatus of semiconductor wafer

An apparatus for terminating a probe that probes a semiconductor device with a signal cable from a tester, the apparatus comprising:

• at least one layer of the probe;
• at least one layer of the signal cable disposed side by side and electrically connected therebetween;
• and
• a shrink tube for shrink-tubing the probe and the signal cable;
• wherein the probe comprises:
• a center conductive probe needle;
• a dielectric layer surrounding the center conductive probe needle;
• a conductive guard layer surrounding the dielectric layer;
• and
• a sleeve surrounding the conductive guard layer;
• wherein the signal cable comprises:
• a center signal conductor;
• a dielectric layer surrounding the center signal conductor;
• a conductive dispersion/guard layer surrounding the dielectric layer;
• and
• a sleeve surrounding the conductive dispersion/guard layer;
• and
• wherein the center conductive probe needle of the probe is disposed side by side with and electrically connects to the center signal conductor of the signal cable, the dielectric layer of the probe is disposed side by side with and connects to the dielectric layer of the signal cable, the conductive guard layer of the probe is disposed side by side with and electrically connects to the conductive dispersion/guard layer of the signal cable, and the sleeve of the probe is disposed side by side with and connects to the sleeve of the signal cable.