Heat dissipating device for electronic component

A heat dissipating device assembly comprising:

• a circuit board having an electronic component mounted thereon;
• a retention module mounted on the circuit board;
• a heat sink attached to the retention module, the heat sink comprising:
• a plurality of fins and a plurality of arcuate spacers interleaved between lower portions of the fins, the spacers contacting the electronic component;
• a heat pipe sequentially extending through the lower portions of the fins, the spacers and upper portions of the fins to bond the fins and the spacers together;
• and
• a fan mounted on the heat sink, wherein
• the arcuate spacer facilitates cooling air from the fan to blow to opposite sides of the fins thereby improving heat dissipation efficiently of the heat sink.

A heat sink assembly comprising:

• a locking part including a frame defining an opening;
• a base part including a plurality of shorter spacers;
• a fin part including a plurality of higher inner fins;
• said spacers being interleaved between bottom portions of said inner fins so as to form a stack including the alternately arranged inner fins and spacers along a horizontal direction under a condition that the interleaved spacer and bottom portions of the inner fins are restrained in the opening of the frame;
• and
• at least one heat pipe extending through said interleaved inner fins and spacers;
• wherein
• a fan is secured to said locking part above both the frame and the interleaved inner fins and spacers.