Enhanced heat exchanger
AssigneeIntel Corporation
InventorsHimanshu Pokharna, Anandaroop Bhattacharya
Life of this patent
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Abstract
According to some embodiments, an enhanced heat exchanger may be provided. The enhanced heat exchanger may comprise, for example, a heat transfer portion to receive heat from a heat source and to transfer heat from the heat source, and a remote heat sink adjacent to the heat transfer portion to remove heat from the heat transfer portion. In some embodiments, the remote heat sink may comprise a solid metal portion that extends away from the heat transfer portion, and a porous medium coupled to the solid metal portion. According to some embodiments, the porous medium may extend away from the solid metal portion such that a thermal boundary layer exists in substantially the entire porous medium.
Claims25
An apparatus, comprising:
- a heat transfer portion to receive heat from a heat source and to transfer heat from the heat source;
- and
- a remote heat sink adjacent to the heat transfer portion to remove heat from the heat transfer portion, the remote heat sink including:
- a solid metal portion that extends away from the heat transfer portion;
- and
- a porous medium coupled to the solid metal portion, wherein the porous medium extends away from the solid metal portion such that a thermal boundary layer exists in substantially the entire porous medium.
A method, comprising:
- transferring heat from a heat source using a heat transfer device adjacent to the heat source;
- and
- dissipating heat from the heat transfer device using a remote heat sink adjacent to the heat transfer device, the remote heat sink having:
- a solid metal portion that extends away from the heat transfer portion;
- and
- a porous medium coupled to the solid metal portion, wherein the porous medium extends away from the solid metal portion such that a thermal boundary layer exists in substantially the entire porous medium.
A system, comprising:
- a substrate;
- an electronic component mounted on the substrate;
- a heat transfer device to receive heat from the electronic component and to transfer heat from the electronic component;
- a remote heat sink adjacent to the heat transfer device to remove heat from the heat transfer device, the remote heat sink including:
- a plurality of fins extending away from the heat transfer device;
- and
- a porous medium attached between the plurality of fins such that a thermal boundary layer exists in substantially the entire porous medium;
- a blower fan to expel heated air from the system;
- and
- a battery adapter to provide battery power to at least one of the electronic component and the blower fan.
Dependencies are inferred from the claim text.