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US 6,958,548 B2Granted
Semiconductor device with magnetically permeable heat sink
AssigneeFreescale Semiconductor, Inc.
InventorsScott K. Pozder, Michelle F. Rasco
Life of this patent
Estimating the term…
Abstract
A semiconductor device is attached to a heat sink by glue that is both thermally conductive and magnetically permeable. The glue fills different features in the surface of the semiconductor device so that there is good coupling between the semiconductor device and the heat sink. The glue is filled with magnetic particles so that the glue is magnetically permeable. The semiconductor device is formed with the heat sink at the wafer level and then singulated after attachment of the heat sink with the glue.
Claims21
An apparatus comprising:
- a thinned active semiconductor substrate;
- a support substrate for supporting the thinned active semiconductor substrate;
- and
- a magnetically permeable glue disposed between the active semiconductor substrate and the support substrate.
1 more element
An apparatus comprising:
- a thinned integrated circuit wafer;
- a support wafer being magnetically permeable and comprising at least one of the group consisting of cobalt, nickel, and iron;
- and
- a glue being magnetically permeable, the glue being disposed between the integrated circuit wafer and the support wafer and comprising at least one of the group consisting of cobalt, nickel, and iron.
1 more element
An apparatus comprising:
- a thinned integrated circuit wafer;
- a support wafer having a first characteristic, the first characteristic being at least one of the group consisting of thermally conductive, electrically conductive and magnetically permeable;
- and
- a glue having the first characteristic, the glue being disposed between the integrated circuit wafer and the support wafer;
- wherein the glue comprises:
- a bonding agent;
- and a first characteristic enhancing agent;
- wherein the first characteristic enhancing agent comprises a plurality of colloidal-sized particles suspended in the bonding agent, the colloidal particles being monolithic and coated nanosilica spheres.
5 more elements
Dependencies are inferred from the claim text.