Metal bump with an insulating sidewall and method of fabricating thereof
AssigneeAu Optronics Corporation
InventorsMing-Yi Lay, Yong-Fen Hsieh, Shang-Kung Tsai, Chin-Kun Lo
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Abstract
Metal bumps for connecting a nonconducting substrate and a chip without lateral shorting are provided. In a first preferred embodiment, an insulating layer covers the entire sidewalls of all the metal bumps. In a second preferred embodiment, predetermined portions of a first metal bump and a second metal bump are covered with an insulating layer. For example, a first predetermined portion of the sidewall of the first metal bump may be zcovered with an insulating layer, while a second predetermined portion of the sidewall of the second sidewall is also covered with an insulating layer.
Claims8
A plurality of metal bumps for connecting a nonconducting substrate and a chip, comprising:
- at least a first metal bump having a first sidewall, the first sidewall comprising a first predetermined area;
- and
- at least a second metal bump separated from the first metal bump having a second sidewall, the second sidewall comprising a second predetermined area adjacent to the first predetermined area;
- wherein the first predetermined area is covered with an insulating layer, and the second predetermined area is not covered by the insulating layer.
Dependencies are inferred from the claim text.