Microelectronic packages having rail along portion of lid periphery
AssigneeHoneywell International Inc.
InventorJai Subramanian
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Abstract
The invention encompasses microelectronic package lids, heat spreaders, and semiconductor packages comprising microelectronic lids or heat spreaders. In particular aspects of the present invention, a microelectronic lid comprises a material having a rectangular peripheral shape that defines 4 peripheral sides. Further, the lid has projecting peripheral rails along less than all of the peripheral edge. For instance, the lid can have projecting peripheral rails along only 2 of the sides. Alternatively, such microelectronic lid can be described as comprising a generally rectangular shape defining four peripheral edges, with two of the edges having a greater thickness than the other two edges.
Claims14
A microelectronic package, comprising:
- a base;
- a chip supported by the base;
- a microelectronic lid over the chip;
- the chip accordingly being packaged between the microelectronic lid and the base;
- a thermally conductive connection between the microelectronic lid and the chip;
- and
- the lid comprising:
- a lid material having a shape and a peripheral edge surrounding the shape;
- the lid material comprising metal-plated copper or metal-plated aluminum:
- a surface surrounded by the peripheral edge;
- a rail which extends along only a portion of the peripheral edge and which is elevationally raised relative to the surface;
- and
- the shape being a rectangular shape defining four peripheral sides of the peripheral edge, the rail extending along an entirety of two of the peripheral sides and not extending laterally beyond the peripheral edge, while at least a predominate portion of the remaining two sides does not have the rail extending there-along.
Dependencies are inferred from the claim text.