US 6,958,534 B2 · Power semiconductor module

Abstract

A power semiconductor module has a base plate comprising a framelike housing, a cap, and at least one electrically insulated substrate disposed inside the housing. The substrate comprises an insulation body with a plurality of metal connection tracks located thereon and insulated from one another, power semiconductor components located on the connection tracks, and terminal elements leading to the outside of the power semiconductor module for load and auxiliary contacts. Some of these terminal elements in the interior of the power semiconductor module comprise contact springs, which are disposed between the connection tracks and contact points on a printed circuit board. The printed circuit board has conductor tracks, which connect the contact points to contact elements that lead to the outside of the power semiconductor module.

Claims18

Dependent claims

A power semiconductor module for mounting to a heat sink, comprising:

a framelike housing having an interior and an exterior;
a cap;
and
at least one electrically insulated substrate, disposed in said interior of said housing, which substrate includes an insulation body with a plurality of metal connection tracks located thereon and insulated from one another, power semiconductor components located on the connection tracks and electrically connected to said connection tracks, and terminal elements, leading to said exterior of said housing;
wherein at least some of said terminal elements in said interior of said housing are formed by contact connectors that are disposed between connection tracks and contact points on a printed circuit board, and wherein said printed circuit board has conductor tracks which connect said contact points to contact elements leading to said exterior of said housing.

2 more elements

Dependencies are inferred from the claim text.

Power semiconductor module

Life of this patent

Power semiconductor module

Life of this patent

Abstract

Claims18