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US 6,958,533 B2Granted
High density 3-D integrated circuit package
AssigneeHoneywell International Inc.
InventorsGerard J. Sullivan, Larry R. Adkins, A. James Hughes
Life of this patent
Estimating the term…
Abstract
A slotted file is created by connecting two side walls and a back wall. The side walls have etched grooves facing directly across from each other. The platelet has flanges that fit into the grooves. In one embodiment, a completed cube is formed when the platelets fill the slotted file.
Claims17
A system for three-dimensional packaging of platelets, comprising in combination;
- a slotted file;
- and
- a plurality of platelets which fit into the slotted file, wherein each of the platelets includes a semiconductor chip placed into a chip carrier so that the semiconductor chip contacts a plurality of electrodes located in the chip carrier, and wherein the platelets are stacked in the slotted file;
- and
- epoxy sealing the plurality of platelets into the slotted file to form a three-dimensional integrated circuit package.
2 more elements
Dependencies are inferred from the claim text.