Semiconductor storage device
AssigneeNEC Electronics Corporation
InventorSadao Nakayama
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Abstract
A semiconductor storage device enables various plural memories to be mounted on the same package, and even though size of respective chips and/or position of bonding pad are different, it is capable of providing a stack MCP in which the chips are superimposed. It causes wiring sheet to intervene between an upper chip and a lower chip. There are provided bonding pads and a wiring pattern for connecting these bonding pads in the wiring sheet. A bonding pad of the upper chip is connected to the bonding pad by a first bonding wire, while the bonding pad is connected to a bonding pad of the package substrate by a second bonding wire. According to this construction, the signal from the upper chip is transmitted to the package substrate via the wiring sheet.
Claims7
A semiconductor device, comprising:
- a package substrate having a first pad;
- a first chip having a second pad and formed on said package substrate;
- a wiring substrate formed on said first chip, said wiring substrate having a third pad, a fourth pad and a wiring pattern connected between said third and fourth pads;
- and
- a second chip having a fifth pad and formed on said wiring substrate;
- a first bonding wire connecting said first pad and said third pad;
- and
- a second bonding wire connecting said fourth pad and said fifth pad.
Dependencies are inferred from the claim text.