Leads under chip IC package

An assembly including:

• a semiconductor device having opposed peripheral sides, opposed ends, an active surface in a first horizontal plane, an inactive bottom surface in a second horizontal plane, and a plurality of bonds pads located on the active surface, a first portion of the plurality of bond pads located adjacent one of the opposed peripheral sides and a second portion of the plurality of bond pads located adjacent another of the opposed peripheral sides;
• and
• a lead frame comprising:
• a first plurality of lead fingers extending substantially in the first horizontal plane of the active surface of the semiconductor device, each lead finger of the first plurality of lead fingers terminating adjacent a peripheral side of the opposed peripheral sides of the semiconductor device;
• a second plurality of lead fingers extending below the inactive bottom surface of the semiconductor device, each lead finger of the second plurality of lead fingers having a portion thereof extending adjacent an end of the opposed ends of the semiconductor device and terminating adjacent a peripheral side of the opposed peripheral sides of the semiconductor device;
• and
• a die paddle for the semiconductor device formed by portions of a plurality of die paddle supports forming any desired shape die paddle.