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US 6,958,527 B2Granted
Wiring board having interconnect pattern with land, and semiconductor device, circuit board, and electronic equipment incorporating the same
AssigneeSeiko Epson Corporation
InventorTerunao Hanaoka
Life of this patent
Estimating the term…
Abstract
A wiring board includes a substrate, and an interconnect pattern which is formed on the substrate and includes a land. A penetration hole, which exposes the substrate, is formed in the land. The penetration hole is formed in a region along a periphery of the land.
Claims17
A wiring board comprising:
- a substrate;
- an interconnect pattern which is formed on the substrate and includes a land having a penetration hole;
- and
- a resist layer covering at least the penetration hole, the penetration hole being formed in a region along a periphery of the land.
1 more element
Dependencies are inferred from the claim text.