Method to fabricate passive components using conductive polymer
AssigneeInternational Business Machines Corporation
InventorsLawrence A. Clevenger, Louis L. Hsu, Carl J. Radens, Li-Kong Wang, Kwong Hon Wong
Life of this patent
Estimating the term…
Abstract
A method and structure for an integrated circuit chip has a logic core which includes a plurality of insulating and conducting levels, an exterior conductor level and passive devices having a conductive polymer directly connected to the exterior conductor level. The passive devices contain RF devices which also includes resistor, capacitor, and/or inductor. The resistors can be serpentine resistors and the capacitors can be interdigitated capacitors.
Claims24
An integrated circuit chip structure comprising:
- an integrated circuit chip comprising:
- a logic core;
- a plurality of insulating and conducting levels above said core;
- an exterior conductor level above said insulating and conducting levels;
- and
- passive devices comprising a conductive polymer directly connected to said exterior conductor level of said integrated circuit chip, such that said passive devices comprise an integral part of said integrated circuit chip.
An integrated circuit chip structure comprising:
- an integrated circuit chip comprising:
- a logic core;
- a plurality of insulating and conducting levels above said core;
- and
- an exterior conductor level above said insulating and conducting levels;
- passive devices comprising a conductive polymer directly connected to said exterior conductor level of said integrated circuit chip, such that said passive devices comprise an integral part of said integrated circuit chip;
- and
- a substrate connected to said passive devices on a said passive devices opposite from said exterior conductor level.
An integrated circuit structure comprising:
- an integrated circuit chip having an exterior surface;
- and
- passive comprising a conductive polymer connected to said exterior surface, wherein said passive devices comprise an integral part of said integrated circuit chip.
An integrated structure comprising:
- an integrated circuit chip having an exterior surface;
- and
- passive devices comprising a conductive polymer connected to said exterior surface,
- wherein said passive devices comprise an integral part of said integrated circuit chip, and
- wherein said conductive polymer has a formation processing temperature lower than melting points of all elements within said integrated circuit chip.
Dependencies are inferred from the claim text.