Compliant and hermetic solder seal
AssigneeAgilent Technologies, Inc.
InventorsGiles Humpston, Yoshikatsu Ichimura, Nancy M. Mar, Daniel J. Miller, Michael J. Nystrom, Heidi L. Reynolds, Gary R. Trott
Life of this patent
Estimating the term…
Abstract
A solder joint or seal attaching components having dissimilar coefficients of thermal expansion is made thin (e.g., less than 20 μm and preferably about 5 μm) and of a solder such as an indium-based solder that has a tendency to creep. The solder is toroidal or otherwise shaped to avoid tensile stress in the solder. Axial shearing stress in the solder causes reversible creep without causing failure of the joint or seal. In one embodiment, a toroidal solder seal has a diameter, a footprint, and a thickness in approximate proportions of 5000:200:1.
Claims12
A solder joint comprising:
- first and second components having different coefficients of thermal expansion;
- and
- solder between and attached to the first and second components, wherein the solder has a toroidal shape and surrounds a cavity formed between the first and second components, and the solder is an indium based alloy that is 48% tin by weight.
A solder joint comprising:
- first and second components having dissimilar coefficients of thermal expansion;
- and
- solder between and attached to the first and second components, wherein the solder has a thickness less than 20 μm and has a tendency to creep in response to shearing stress caused by thermal expansion of the first and second components, and wherein the solder is an indium based alloy that is 48% tin by weight.
Dependencies are inferred from the claim text.