Methods of fabricating crossbar array microelectronic electrochemical cells
AssigneeNorth Carolina State University
InventorsVeena Misra, John Damiano, Jr.
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Abstract
The present invention provides microelectronic electrochemical structures and related fabrication methods. A composite microelectronic structure is provided that includes first and second conductors dielectrically isolated from one another at a crossing thereof, the crossing surrounded by a dielectric material. A portion of the dielectric material around the crossing of the first and second conductors is removed to form a well that exposes respective outer surfaces of the first and second conductors and a molecule is deposited in the well such that the deposited molecule contacts the exposed outer surfaces of the first and second conductors.
Claims34
A method of fabricating a microelectronic electrochemical cell, the method comprising:
- providing a composite microelectronic structure comprising first and second conductors dielectrically isolated from one another at a crossing thereof, the crossing surrounded by a dielectric material;
- removing a portion of the dielectric material around the crossing of the first and second conductors to form a well that exposes respective outer surfaces of the first and second conductors;
- and
- depositing a molecule in the well such that the deposited molecule contacts the exposed outer surfaces of the first and second conductors.
A method of fabricating a microelectronic electrochemical cell, the method comprising:
- providing a composite microelectronic structure comprising first and second conductors dielectrically isolated from one another at a crossing thereof, the crossing surrounded by a dielectric material;
- removing a portion of the dielectric material around the crossing of the first and second conductors to form a well that exposes respective outer surfaces of the first and second conductors;
- and
- removing a portion of the dielectric material separating the first and second conductors at the crossing to expose opposing faces of the first and second conductors.
A method of fabricating a cell, comprising:
- forming a first conductor on a substrate;
- forming a first dielectric layer on the first conductor;
- forming a second conductor on the dielectric layer such that the first and second conductors cross;
- forming a second dielectric layer on the substrate;
- and
- patterning the first and second dielectric layers to form a well that exposes respective outer surfaces of the first and second conductors.
Dependencies are inferred from the claim text.