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US 6,958,262 B2Granted
Mounting structure of semiconductor device and mounting method thereof
AssigneeNEC Corporation
InventorHirokazu Miyazaki
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AssigneeNEC Corporation
InventorHirokazu Miyazaki
Estimating the term…
An insulating sheet which connects a semiconductor chip and a wiring substrate is provided between the semiconductor chip and the wiring substrate. The insulating sheet has windows therethrough at positions corresponding to those of connection pads of the wiring substrate and has leads, one end of each of the leads being fixed on the sheet and the other end of each of the leads protruding from the opposite surface of the sheet through a window. Each of solder balls of the semiconductor chip is connected to the fixed one end of one of the leads, and each of the connection pads is connected to the other end of each of the leads to electrically connect the semiconductor chip and the wiring substrate.
A mounting method of a semiconductor device for mounting a semiconductor chip provided with a plurality of solder balls on a wiring substrate provided with a plurality of connection pads, comprising:
Dependencies are inferred from the claim text.
From the US filing history. Foreign family members aren’t listed.
Leadless components: having an array of bottom contacts, e.g. pad grid array or ball grid array components
Package configurations: characterised by the relative positions of pads or connectors relative to package parts
Structural association of two or more printed circuits: one or more single auxiliary printed circuits mounted on a main printed circuit, e.g.…
Surface mounted components: leaded components
Term ended 21 Feb 2021 (estimated)
Drawings are temporarily unavailable. Open the PDF at USPTO
1. Field of the Invention
The present invention relates to a mounting structure of a semiconductor device which can be easily detached from a wiring substrate after being mounted on the wiring substrate and a mounting method thereof.
2. Description of the Related Art
These and other objects, features and advantages of the invention will become more fully apparent from the following detailed description taken in conjunction with accompanying drawings:
FIG. 1 illustrates the structure of a first embodiment according to the present invention;
FIG. 2 is a perspective view illustrating the structure of the first embodiment;
A first embodiment of a mounting structure of a semiconductor device is now described-in-detail with reference to the drawings. With reference to FIGS. 1 and 2, the first embodiment of the present invention includes a semiconductor chip 1, an insulating sheet 2, and a wiring substrate 5.
A plurality of pads 3 for electric connection to the external are arranged to be lattice-like on one surface of the semiconductor chip 1. Solder balls 6 are attached to the plurality of pads 3, respectively. A Stannum/Plumbum(Sn/Pb) alloy, an Stannum/Bismuth/Argentum (Sn/Bi/Ag) alloy, a Stannum/Silver (Sn/Ag) alloy or the like is used for the composition of the solder balls 6.
The wiring substrate 5 has therein internal wirings 7 formed of a conductive material such as Copper (Cu). Further, the wiring substrate 5 has on its surface where the semiconductor chip 1 is mounted a plurality of connection pads 8 corresponding to the pads 3 of the semiconductor chip 1, respectively. The respective plurality of connection pads 8 are connected to the internal wirings 7 to be electrically connected to a power source layer or other components.