Optical sensor package

A method of making an image sensor device, comprising the steps of:

• providing a QFN type leadframe having a central die attach flag and an outer bonding pad area having a plurality of bonding pads, wherein the flag has a perimeter ring that forms a bond line having a height that is about the same as a thickness of the leadframe;
• disposing a die attach material on the flag and within the perimeter ring;
• attaching a sensor integrated circuit (IC) to the flag with the die attach material, the IC having a first surface with an active area and a peripheral bonding pad area, the peripheral bonding pad area including bonding pads;
• placing the leadframe on a stage curing heat block having a vacuum hole at a central position under the flag;
• electrically connecting respective ones of the IC bonding pads and corresponding ones of the leadframe bonding pads with a plurality of wires via wirebonding;
• dispensing a clear compound over the IC active area;
• placing a transparent cover over the clear compound on the IC active area, wherein light may pass through the cover and the compound and onto the IC active area;
• and
• forming a mold compound over the leadframe, wirebonds and a peripheral portion of the cover.