Hydrogen gettering system
AssigneeTexas Instruments Incorporated
InventorsJohn M. Bedinger, Clyde R. Fuller
Life of this patent
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Abstract
A method, system and materials for use in hydrogen gettering in conjunction with microelectronic and microwave components that are generally hermetically sealed in an enclosure typically referred to as a “package”. Gettering materials that can be used include titanium with or without a hydrogen permeable coating or covering, alloys of zirconium-vanadium iron and zeolites and several ways to apply these materials to the package. In addition, the hydrogen permeable material can be used over a vent from the interior of the package to the exterior wherein hydrogen will escape from the package interior when the hydrogen concentration within the package is greater than without the package.
Claims15
A method of making a package containing a substantially hydrogen-free interior which comprises the steps of:
- (a) providing a hermetically sealed package having a hollow interior region;
- (b) providing a hydrogen degradable semiconductor device material within said hollow interior;
- (c) forming a hydrogen permeable layer onto a surface of said package;
- (d) then forming a vent through said package from said hollow interior region to the exterior of said package through said layer to form a hydrogen permeable layer over said vent.
Dependencies are inferred from the claim text.