Method and apparatus for forming an electrical contact with a semiconductor substrate

A method of plating a first region of an article, comprising:

• providing a plating fluid bath;
• providing an anode electrode in contact with said plating fluid bath;
• exposing said first region of said article to said plating fluid bath;
• providing a cathode electrode not in physical contact with said second region of said article;
• providing a non-plating electrically conducting liquid that makes physical and electrical contact to a second region of said article, wherein said electrically conducting liquid electrically couples said cathode electrode to said second region of said article;
• substantially separating said electrically conducting liquid from said plating fluid bath;
• and
• applying a voltage potential across said anode and cathode electrodes to cause current to flow in a series path comprising said anode electrode said plating fluid bath, said first region of said article, said second region of said article, said electrically conducting liquid, and said cathode electrode.

A method of plating a first region of an article, comprising:

• providing a plating fluid bath;
• providing an anode electrode in contact with said plating fluid bath;
• exposing said first region of said article to said plating fluid bath;
• providing a cathode electrode;
• providing a non-plating electrically conducting liquid that makes physical and electrical contact to a second region of said article, wherein said electrically conducting liquid electrically couples said cathode electrode to said second region of said article;
• substantially separating said electrically conducting liquid from said plating fluid bath;
• and
• applying a voltage potential across said anode an cathode electrodes to cause current to flow in a series path formed by said anode electrode, said plating fluid bath, said first region of said article, said second region of said article, said electrically conducting liquid, and said cathode electrode.

A method of plating a first region of an article, comprising:

• providing a plating fluid bath;
• providing an anode electrode in contact with said plating fluid bath;
• exposing said first region of said article to said plating fluid bath;
• providing a cathode electrode;
• providing a non-plating electrically conducting liquid that makes physical and electrical contact to a second region of said article, wherein said electrically conducting liquid electrically couples said cathode electrode to said second region of said article;
• and
• applying a voltage potential across said anode and cathode electrodes to cause current to flow in a series path formed by said anode electrode, said plating fluid bath, said first region of said article, said second region of said article, said electrically conducting liquid, and said cathode electrode.