Material separation to form segmented product
AssigneeEndicott International Technologies, Inc.
InventorsTimothy E. Antesberger, John S. Kresge
Life of this patent
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Abstract
A method of removing selected portions of material from a base material using a plurality of different depth cuts (e.g., using laser cutting) such that apertured sections (or segments) are expeditiously removed for eventual use with another component or otherwise. In one example, the segmented section so removed can be used to bond various elements of an electronic package which in turn can then be positioned and used within an information handling system such as a computer, server, mainframe, etc.
Claims31
A method of removing selected portions of a first material from a base material, said method comprising:
- providing a layer of base material;
- positioning a layer of first material and a layer of release material on said layer of base material such that said layer of release material is located substantially between said layer of base material and said layer of first material, said layer of first material consisting of three sublayers, a first of said sublayers being comprised of a polymer and the second and third of said sublayers comprised of an adhesive and located on opposite sides of said first sublayer;
- providing a plurality of first cuts through said layer of first material;
- providing a plurality of deeper, second cuts through said layer of release material and said layer of first material;
- and
- separating said layer of said first material from said layer of base material so as to remove only selected portions of said first material and leave other portions of said first material on said layer of base material.
A method of removing selected portions of a first material from a base material, said method comprising:
- providing a layer of base material;
- positioning a layer of first material and a layer of release material on said layer of base material such that said layer of release material is located substantially between said layer of base material and said layer of first material, said layer of said first material being comprised of an adhesive;
- providing a plurality of first cuts through said layer of first material;
- providing a plurality of deeper, second cuts through said layer of release material and said layer of first material;
- separating said layer of said first material from said layer of base material so as to remove only selected portions of said first material and leave other portions of said first material on said layer of base material;
- providing a first circuitized substrate and a component;
- and
- securing said component to said first circuitized substrate using said selected portions of said first material.
Dependencies are inferred from the claim text.