Polyamide resin-containing varnish and its use
AssigneeNippon Kayaku Kabushiki Kaisha
InventorsMasahiro Imaizumi, Toyofumi Asano, Masaki Shinmoto
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Abstract
An object of the present invention is to provide a polyamide resin composition from which the solvent is easily removed during film formation and which gives a film or adhesive layer reduced in residual solvent content. It is suitable for use especially as vanish. The composition and vanish are characterized by comprising as essential ingredients a phenolic hydroxyl group-having aromatic polyamide resin and a cycloalkanone as a solvent and preferably further containing a curable resin.
Claims14
A polyamide resin-containing varnish comprising a phenolic hydroxyl group-having aromatic polyamide resin (A) and, as a solvent, cyclopentanone (B).
A polyamide resin-containing varnish comprising a block copolymer formed from a phenolic hydroxyl group-having aromatic polyamide resin terminated with an aminoaryl group at both ends and a poly(butadiene-acrylonitrile) copolymer having a carboxyl group at both terminals, and a cycloalkanone having from 4 to 8 carbon atoms.
A polyamide resin-containing varnish comprising a block copolymer of the following formula (2):
- wherein x, y, z, l, m and n each represents an average degree of polymerization, and x is from 3 to 10, y is from 1 to 4, z is from 5 to 15, (l+m) is an integer of from 2 to 200, l/(m+l)≧0.04, and n is from 2 to 100, and a cycloalkanone having from 4 to 8 carbon atoms.
Dependencies are inferred from the claim text.