Tantalum sputtering target and method of manufacture
AssigneeHoneywell International Inc.
InventorsHarry Rosenberg, Bahri Ozturk, Guangxin Wang, Wesley LaRue
Life of this patent
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Abstract
Described is a method for producing high purity tantalum, the high purity tantalum so produced and sputtering targets of high purity tantalum. The method involves purifying starting materials followed by subsequent refining into high purity tantalum.
Claims13
A capacitor comprising high purity tantalum comprising tantalum, less than about 500 parts per million, by weight, total metallic impurities, and less than about 50 parts per million, by weight, tungsten or molybdenum.
A capacitor comprising a material sputter deposited from a target blank, the material comprising tantalum, less than 500 parts per million by weight total metallic impurities, less than or equal to 50 parts per million by weight molybdenum or tungsten, and less than about 100 parts per million by weight oxygen.
A capacitor comprising a material sputter deposited from a target blank, the material comprising tantalum, less than 500 parts per million by weight total metallic impurities, less than 5 parts per million by weight total of molybdenum and tungsten, less than about 100 parts per million by weight oxygen, and less than or equal to 10 parts per billion by weight each of uranium and thorium.
A capacitor comprising material sputter deposited from a target blank, the material comprising tantalum, less than 500 parts per million by weight total metallic impurities, less than 2 parts per million by weight total of molybdenum and tungsten, and less than 25 parts per million by weight oxygen.
Dependencies are inferred from the claim text.