Lead-less surface mount reed relay
AssigneeMeder Electronic
InventorsJohn Beigel, Gunther Samuel, John Boyington, Jr.
Life of this patent
Estimating the term…
Abstract
A reed relay or reed sensor device that is substantially lead-less and has minimal inductance can be manufactured as an individual unit or as a plurality of units. The reed relay or reed sensor device comprises a substrate that has a plurality contacts on the exterior of the device connected to contacts on the interior of the device capable of maintaining a signal pathway to the internal components of the device. The internal components further comprise a reed switch, an electrical shield, a coil bobbin, and a coil of electrical wire which when energized is capable of effectuating switching in the reed relay.
Claims23
A reed switch module, comprising:
- a reed switch device further comprising a plurality of contact tongues merged in a tube, the contact tongues terminating in signal leads extending outside the tube, a ground shield conductor disposed around the exterior of the tube, and a magnetic coil assembly disposed around the exterior of the ground shield conductor, said magnetic coil assembly further comprising a coil bobbin and a wire coil wrapped around the coil bobbin;
- a substrate having a main body with a top surface and a bottom surface, said reed switch device being disposed on said substrate;
- a plurality of contacts on the top surface of said substrate engaging the signal leads, the around shield conductor and the wire coil of the reed switch device and a plurality of contacts on the bottom surface of said substrate, said plurality of contacts on the top surface and said plurality of contacts on the bottom surface connected through electrically conductive paths;
- and
- an over mold being disposed on the top surface of the substrate and containing the reed switch device.
A reed switch module, comprising:
- a reed switch device further comprising a plurality of contact tongues merged in a tube, the contact tongues terminating in signal leads extending outside the tube, a ground shield conductor disposed around the exterior of the tube, a magnetic coil assembly disposed around the exterior of the ground shield conductor, said magnetic coil assembly further comprising a coil bobbin and a wire coil wrapped around the coil bobbin;
- a substrate having a main body with a top surface and a bottom surface, said reed switch device being disposed on said substrate;
- a plurality of contacts on the top surface of said substrate engaging the signal leads, the ground shield conductor and the wire coil of the reed switch device and a plurality of contacts on the bottom surface of said substrate, said plurality of contacts on the top surface and said plurality of contacts on the bottom surface connected through electrically conductive paths;
- and
- an over mold being disposed on the top surface of the substrate and containing the reed switch device, said over mold recessed from a plurality of sides of said substrate.
A reed switch module comprising:
- a reed switch device further comprising a plurality of contact tongues in a tube, the plurality of contact tongues terminating in a plurality of signal leads extending outside the tube, the plurality of signal leads connected to a plurality of signal contacts, a ground shield conductor disposed around the tube and connected to a plurality of ground contacts, and a magnetic coil assembly disposed around the ground shield conductor, the magnetic coil assembly further comprising a wire wrapped around a coil bobbin where the wire is connected to coil contacts;
- a substrate having a top surface, a bottom surface, and a depression in the top surface for receiving the reed switch device;
- and
- a plurality of contacts on the top surface of the substrate engaging the plurality of signal leads, the ground shield conductor and the wire of the reed switch device and a plurality of contacts on the bottom surface of the substrate, the plurality of contacts on the top surface and the plurality of contacts on the bottom surface connected through electrically conductive paths.
Dependencies are inferred from the claim text.