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US 6,946,410 B2Granted
Method for providing nano-structures of uniform length
AssigneeE. I. Du Pont de Nemours and Company
InventorsRoger Harquail French, Timothy Gierke, Mark Andrew Harmer, Anand Jagota, Steven Raymond Lustig, Rakesh H. Mehta, Paula Beyer Hietpas, Bibiana Onoa
Life of this patent
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Abstract
This invention relates to the field of nanotechnology. Specifically the invention describes a method for cutting a multiplicity of nano-structures to uniform dimensions of length, length and width, or area, or to a specific distribution of lengths or area using various cutting techniques.
Claims41
A method for cutting a population of nano-structures to a uniform length or distribution of lengths comprising:
- a) coating a population of nano-structures on a solid substrate wherein the nano-structures are spatially fixed on the surface of the substrate;
- b) identifying discrete portions of the coated nano-structures of step (a) according to a patterning system;
- and
- c) applying a cutting means to the identified discrete portions of the nano-structures of step (b) whereby the nano-structures are cut to a uniform length or distribution of lengths;
- wherein the population of nano-structures is optionally suspended in a dispersant solution prior to coating.
2 more elements
A method for cutting a population of nano-structures to a uniform length or distribution of lengths comprising:
- a) coating a population of nano-structures on a solid substrate wherein the nano-structures are spatially fixed on the surface of the substrate;
- b) identifying discrete portions of the coated nano-structures of step (a) according to a patterning system;
- and
- c) applying a cutting means to the identified discrete portions of the nano-structures of step (b) whereby the nano-structures are cut to a uniform length or distribution of lengths;
- wherein the patterning system is selected from the group consisting of topographically directed etching, printing, molding, and embossing.
2 more elements
A method for cutting a population of nano-structures to a uniform length or distribution of lengths comprising:
- a) coating a population of nano-structures on a solid substrate wherein the nano-structures are spatially fixed on the surface of the substrate;
- b) identifying discrete portions of the coated nano-structures of step (a) according to a patterning system;
- and
- c) applying a cutting means to the identified discrete portions of the nano-structures of step (b) whereby the nano-structures are cut to a uniform length or distribution of lengths;
- wherein the cutting means is photon irradiation utilizing ionized radiation selected from the group consisting of ultraviolet rays, X-rays, electron irradiation, ion-beam irradiation, plasma ionization, and neutral atoms machining.
2 more elements
A method for cutting a population of nano-structures to a uniform length or distribution of lengths comprising:
- a) coating a population of nano-structures on a solid substrate wherein the nano-structures are spatially fixed on the surface of the substrate;
- b) identifying discrete portions of the coated nano-structures of step (a) according to a patterning system;
- and
- c) applying a cutting means to the identified discrete portions of the nano-structures of step (b) whereby the nano-structures are cut to a uniform length or distribution of lengths;
- wherein the nano-structures are mixed in a surfactant prior to coating.
2 more elements
A method for cutting a population of nano-structures to a uniform length or distribution of lengths comprising:
- a) coating a population of nano-structures on a solid substrate wherein the nano-structures are spatially fixed on the surface of the substrate;
- b) identifying discrete portions of the coated nano-structures of step (a) according to a patterning system;
- and
- c) applying a cutting means to the identified discrete portions of the nano-structures of step (b) whereby the nano-structures are cut to a uniform length or distribution of lengths;
- wherein the nano-structures are mixed with a DNA solution prior to coating.
2 more elements
A method for cutting a population of nano-structures to a uniform length or distribution of lengths comprising:
- a) coating a population of nano-structures on a solid substrate wherein the nano-structures are spatially fixed on the surface of the substrate;
- b) identifying discrete portions of the coated nano-structures of step (a) according to a patterning system;
- and
- c) applying a cutting means to the identified discrete portions of the nano-structures of step (b) whereby the nano-structures are cut to a uniform length or distribution of lengths;
- wherein the nano-structures are coated on the solid substrate in layers separated by layers of a separator material.
2 more elements
A method for cutting a population of nano-structures to a uniform length or distribution of lengths comprising:
- a) coating a population of nano-structures on a solid substrate wherein the nano-structures are spatially fixed on the surface of the substrate;
- b) identifying discrete portions of the coated nano-structures of step (a) according to a patterning system;
- and
- c) applying a cutting means to the identified discrete portions of the nano-structures of step (b) whereby the nano-structures are cut to a uniform length or distribution of lengths;
- wherein the nanotubes are recovered by a process comprising sonication in the presence of a nanotube stripper.
2 more elements
A method for cutting a population of nano-structures to a uniform length or distribution of lengths comprising:
- a) coating a population of nano-structures on a solid substrate wherein the nano-structures are spatially fixed on the surface of the substrate;
- b) identifying discrete portions of the coated nano-structures of step (a) according to a patterning system;
- and
- c) applying a cutting means to the identified discrete portions of the nano-structures of step (b) whereby the nano-structures are cut to a uniform length or distribution of lengths;
- wherein the patterning system is photolithography applying a photomask and wherein the photomask applies a pattern selected from the group consisting of a rectangle, and a circle and combinations thereof.
2 more elements
A method for cutting a population of nano-rods of uniform length or distribution of lengths comprising:
- a) providing a nano-rod cutting device comprising:
- (i) a solid substrate;
- (ii) a first dispersant layer formed on the substrate, said first dispersant layer comprising a population of nano-rods of varying lengths;
- (iii) a second positive resist layer formed on the first dispersant layer;
- and
- (iv) a photomask having a pattern of light transmitting and non-transmitting regions proximate to said second positive resist layer;
- b) exposing the nano-rod cutting device to a light source whereby light is transmitted through the light transmitting regions of the photomask and degrades the second positive resist layer to the level of the first dispersant layer;
- c) removing the degraded positive resist from the device of (b) whereby the first dispersant layer is exposed;
- d) irradiating the device of (c) whereby the exposed dispersant layer is degraded and the nano-rods are cut, producing a population of nano-rods of uniform length or distribution of lengths corresponding to the pattern of light transmitting regions of the photomask.
6 more elements
A method for cutting a population of nano-rods of uniform length or distribution of lengths comprising:
- a) providing a nano-rod cutting device comprising:
- (i) a solid substrate;
- (ii) a first dispersant layer formed on the substrate, said first layer comprising a population of nano-rods of varying lengths in a dispersant solution;
- (iii) a second negative resist layer formed on the first dispersant layer;
- and
- (iv) a photo-mask having a pattern of light transmitting and non-transmitting regions proximate to said second negative resist layer;
- b) exposing the nano-rod cutting device to a light source whereby light is transmitted through the light transmitting regions of the photomask and crosslinks the second negative resist layer to the level of the first dispersant layer;
- c) removing the unstabilized negative resist from the device of (b) with a negative resist developer whereby the first dispersant layer is exposed;
- and
- d) irradiating the device of (c) whereby the exposed dispersant layer is degraded and the nano-rods are cut, producing a population of nano-rods of uniform length or distribution of lengths corresponding to the pattern of light transmitting regions of the photomask.
7 more elements
A method for cutting a population of nano-rods of uniform length or distribution of lengths comprising:
- a) providing a nano-rod cutting device comprising:
- (i) a solid substrate;
- (ii) a first dispersant layer formed on the substrate, said first layer comprising a population of nano-rods of varying lengths in a dispersant solution;
- and
- (iii) a second imprintable resist layer formed on the first dispersant layer;
- and
- b) contacting the device of (a) with an imprinting substrate such that regions of degradation are created in a pattern on the imprintable resist exposing the dispersant layer;
- c) irradiating the device of (b) whereby the exposed dispersant layer is degraded and the nano-rods are cut, producing a population of nano-rods of uniform length or distribution of lengths corresponding to the pattern applied by the imprinting substrate.
5 more elements
A method for cutting a population of nano-rods of uniform length or distribution of lengths comprising:
- a) providing a nano-rod cutting device comprising:
- (i) a solid substrate;
- (ii) a first dispersant layer formed on the substrate, said first layer comprising a population of nano-rods of varying lengths in a dispersant solution;
- and
- (iii) a second premolded resist layer formed on the first dispersant layer having regions of patterned degradation in the premolded resist exposing the dispersant layer;
- and
- b) irradiating the device of (a) whereby the exposed dispersant layer is degraded and the nano-rods are cut, producing a population of nano-rods of uniform length or distribution of lengths corresponding to the pattern applied of the premolded resist.
4 more elements
A method for cutting a population of nano-rods of uniform length or distribution of lengths comprising:
- (a) providing a nano-rod cutting device comprising:
- (i) solid substrate affixed to an endless conveyor means;
- (ii) a first bath of nano-rods in dispersant solution
- (iii) a second resist bath
- (iv) a baking means
- (v) a patterning means
- (vi) a third developing bath
- (vii) an irradiating source
- (viii) a fourth nanostripper bath
- b) moving the solid substrate by way of the conveyor means sequentially into the first bath nano-rods in dispersant solution whereby the solid substrate is immersed in the dispersant solution;
- c) moving the immersed solid substrate of (b) out of the first bath whereby the dispersing is dried and the nano-rods are affixed to the solid substrate;
- d) moving the substrate of (c) into a second resist bath wherein the affixed nano-rods are coated with a resist;
- e) moving the substrate of(d) through a baking means whereby the resist is baked on the substrate;
- f) exposing the substrate of (e) to light through the patterning means whereby the resist is degraded according to the pattern of the patterning means;
- g) moving the exposed substrate of (f) into a third developing bath whereby the resist is developed and removed;
- h) irradiating the resist-free substrate of (g) such that the nano-rods on the substrate are cut in the pattern produced by the patterning means;
- and
- i) moving the substrate of (h) containing the cut nano-rods into the fourth nano-stripper bath whereby the cut nano-rods are removed from the substrate and recovered.
15 more elements
A nano-structure cutting device comprising:
- (i) a solid substrate;
- (ii) a first dispersant layer formed on the substrate, said first layer comprising a population of aligned nano-rods of varying lengths in a dispersant solution;
- (iii) a second resist layer formed on the first dispersant layer;
- and
- (iv) a photo-mask having a pattern of light transmitting and non-transmitting regions proximate to said second resist layer.
2 more elements
A nano-structure cutting device of 33 claim wherein the solid substrate is comprised of materials selected from the group consisting of, silicon, silicon dioxide, glass metals polymers, ceramics, and crystals.
A method of fabricating a nano-structure cutting device comprising:
- (a) providing a solid substrate;
- (b) forming a first dispersant layer on said substrate said first layer comprising a population of nano-structures of varying lengths in a dispersant solution;
- (c) baking the dispersant layer on said substrate to remove excess dispersant and to affix said nano-structures to said substrate;
- (d) forming a second resist layer formed on the first dispersant layer;
- and
- (e) affixing a photo-mask having a pattern of light transmitting and non-transmitting regions proximate to said second resist layer.
3 more elements
Dependencies are inferred from the claim text.