Polyparaxylylene film, production method therefor and semiconductor device
AssigneeHitachi, Ltd.
InventorsAkio Takahashi, Yuichi Satsu, Igor Yefimovich Kardash, Andrei Vladimirovich Pebalk, Sergei Nicolaevich Chvalun, Karen Andranikovich Mailyan
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Abstract
An organic polymer film of low dielectric constant and high heating resistance which is applicable as an insulating layer of a semiconductor devices is provided, as well as a manufacturing method for the film and a semiconductor device incorporating the film.
Claims16
A film of porous poly-paraxylylene or a derivative thereof prepared by the process comprising:
- subliming paraxylylene or a derivative cyclic dimer;
- pyrolyzing the resulting product;
- polymerizing the product obtained by pyrolysis;
- and
- heat-treating the resulting polymer,
- wherein said film contains a porous structure of 10 to 50% by volume.
A method of manufacturing a film of porous poly-paraxylylene or a derivative thereof, comprising
- subliming paraxylylene or a derivative cyclic dimer at 30 to 160° C.;
- pyrolyzing the resulting product at 800 to 950° C.;
- polymerizing the product obtained by pyrolysis at −40 to +25° C.;
- and
- heat-treating the resulting polymer at a temperature of at least 170° C.
A film of porous poly-paraxylylene or a derivative thereof prepared by the process comprising:
- subliming paraxylylene or a derivative cyclic dimer at 30 to 160° C.;
- pyrolyzing the resulting product at 800 to 950° C.;
- polymerizing the product obtained by pyrolysis at −40 to +25° C.;
- and
- heat-treating the resulting polymer at a temperature of at least 170° C.,
- wherein the polymer is removed from a polymerization tank and heat-treated after said polymerization process.
A semiconductor device comprising semiconductor elements electrically connected to thin-film wirings formed on an insulating film, wherein said insulating film comprises porous poly-paraxylylene or a derivative thereof prepared by subliming paraxylylene or a derivative cyclic dimer, pyrolyzing the resulting product at 800 to 950° C., polymerizing the product obtained by pyrolysis, and heat-treating the resulting polymer at a temperature of at least 170° C.
Dependencies are inferred from the claim text.