# US 6,944,022 B1 · Ruggedized electronics enclosure

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- Number: US 6,944,022 B1
- Document ID: US6944022B1
- Status: Granted
- Kind: B1
- Application number: 10/850,523
- Filed: 2004-05-19
- Granted: 2005-09-13
- Earliest claimed: 2002-08-30
- Assignees: Themis Computer
- Inventors: William E. Kehret; Dennis H. Smith
- Web page: https://patentgrep.com/patent/US6944022B1

## CPC

- H05K 7/20418: {the radiating structures being additional and fastened onto the housing}
- H05K 7/1434: {for electronics exposed to high gravitational force; Cylindrical housings}
- H05K 7/20254: {Cold plates transferring heat from heat source to coolant}
- H05K 7/20445: {the coupling element being an additional piece, e.g. thermal standoff}
- H05K 7/20509: {Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures}
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

The present invention relates to a ruggedized enclosure for housing and protecting electronic circuits. The enclosure utilizes a top compartment for housing the circuit and a cooling assembly rigidly coupled to the top compartment. The cooling assembly utilizes a passive radiator to for a rigid truss plate structure. The truss plate structure rigidifies the enclosure helping to protect the enclosure and circuit from destructive shock events and destructive vibration events. The cooling assembly further provides an efficient heat exchange for removing heat from the electronic circuit. A method for protecting an electronic circuit utilizing a rigid truss plate structure is also provided.

## Claims

### Claim 1

A ruggedized electronics enclosure for housing an electronic circuit comprising:
a first area configured to house the electronic circuit;
a cooling assembly comprising a rigid truss plate structure, rigidly coupled to first area and thermally coupled to the electronic circuit, the first area, cooling assembly, and electronic circuit providing a rigid structure that does not substantially deform in response to one or more destructive shock events, to protect the electronic circuit against said one or more destructive shock events; and
wherein a first axis aligned with the length of the ruggedized enclosure is in a first direction.

### Claim 2 (depends on 1)

The ruggedized electronics enclosure of claim 1, wherein said first direction is substantially vertical.

### Claim 3 (depends on 1)

The ruggedized electronics enclosure of claim 1, wherein said first direction is substantially horizontal.

### Claim 4 (depends on 1)

The ruggedized electronics enclosure of claim 1, wherein said first direction is substantially in any direction.

### Claim 5

A method of housing and protecting an electronic circuit in a ruggedized electronics enclosure comprising:
enclosing the electronic circuit in a first area;
externally cooling the electronic circuit with a rigid cooling assembly and rigidifying the electronics enclosure by rigidly coupling the cooling assembly comprising a rigid truss plate structure, to the first area, wherein said rigidified electronics enclosure does not substantially deform in response to one or more destructive shock events and a first axis aligned with the length of the ruggedized enclosure is in a first direction.

### Claim 6 (depends on 5)

The method of claim 5, wherein said first direction is substantially vertical.

### Claim 7 (depends on 5)

The method of claim 5, wherein said first direction is substantially horizontal.

### Claim 8 (depends on 5)

The method of claim 5, wherein said first direction is substantially in any direction.