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US 6,943,433 B2Granted
Semiconductor device and manufacturing method for same
AssigneeNichia Corporation
InventorKazuhiro Kamada
Life of this patent
Estimating the term…
Abstract
To provide a light emitting device having a high reliability wherein no resin burrs occur, The semiconductor device comprises a semiconductor element, a package having a recess for housing the semiconductor element and a mold member for sealing the semiconductor element in the recess and the package comprises lead electrodes and a package support part supporting the lead electrodes so that main surfaces of the tip portions of the lead electrodes are exposed from the bottom surface of the recess.
Claims17
A semiconductor device comprising:
- a semiconductor element;
- a package having a recess for housing the semiconductor element, said package comprising lead electrodes and a package support part supporting the lead electrodes whereby tip portions of the lead electrodes are exposed from a surface of the recess;
- a mold member for sealing the semiconductor element in the recess,
- wherein the mold member extends to at least over a portion of the lead electrodes and a portion of the package support part, the package support part has notches in at least one pair of opposite sides of the package support part, and the notches reach the recess.
1 more element
A semiconductor device comprising:
- a semiconductor element;
- a package having a recess for housing the semiconductor element, said package comprising a heat sink, lead electrodes and a package support part supporting the lead electrodes whereby tip portions of the lead electrodes are exposed from a surface of the recess, and
- a mold member for sealing the semiconductor element in the recess,
- wherein a back side of the heat sink is a portion of a mounting surface for mounting the package and the semiconductor element is placed on a surface of the heat sink, and
- wherein the mold member extends to at least over a portion of the lead electrodes and a portion of the package support part, wherein the package support part has notches in at least one pair of opposite sides of the package support part, and the notches reach the recess.
2 more elements
Dependencies are inferred from the claim text.