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US 6,927,649 B2Granted
Component working with acoustic waves and having a matching network
AssigneeEpcos AG
InventorsThomas Metzger, Pasi Tikka, Edgar Schmidhammer, Ralph Stömmer, Habbo Heinze
Life of this patent
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Abstract
A component working with acoustic bulk waves is provided that has a multi-layer substrate, where the multi-layer substrate comprises an integrated matching network and further circuit elements for adapting the electrical filter properties and can serve as carrier substrate for thin-film resonators.
Claims25
A component working with acoustic bulk waves, comprising:
- at least one thin-film resonator, comprising:
- at least one piezoelectric layer and
- at least two electrodes applied in layers;
- the component further comprising:
- a multi-layer substrate comprising:
- an upper side upon which the at least one thin-film resonator is arranged;
- outside electrodes;
- and
- at least one integrated passive or active circuit element to which the at least one thin-film resonator is electrically connected;
- the component further comprising:
- at least one chip component arranged on the upper side of the multi-layer substrate in addition to the at least one thin-film resonator,
- wherein the at least one chip component is a filter chip.
9 more elements
A component working with acoustic bulk waves, comprising:
- at least one thin-film resonator, comprising:
- at least one piezoelectric layer and
- at least two electrodes applied in layers;
- the component further comprising:
- a multi-layer substrate comprising:
- an upper side upon which the at least one thin-film resonator is arranged;
- outside electrodes;
- and
- at least one integrated passive or active circuit element to which the at least one thin-film resonator is electrically connected;
- the component further comprising:
- a carrier substrate upon which the at least one thin-film resonator is deposited, the at least one thin-film resonator being electrically connected with bond wires to the at least one circuit element integrated in the multi-layer substrate, the carrier substrate being arranged on an upper side of the multi-layer substrate.
8 more elements
A component working with acoustic bulk waves, comprising:
- at least one thin-film resonator, comprising:
- at least one piezoelectric layer and
- at least two electrodes applied in layers;
- the component further comprising:
- a multi-layer substrate comprising:
- an upper side upon which the at least one thin-film resonator is arranged;
- outside electrodes;
- and
- at least one integrated passive or active circuit element to which the at least one thin-film resonator is electrically connected;
- the component further comprising:
- a cavity located between an active region of the at least one thin film resonator and the multi-layer substrate.
8 more elements
A component working with acoustic bulk waves, comprising:
- at least one thin-film resonator, comprising:
- at least one piezoelectric layer and
- at least two electrodes applied in layers;
- the component further comprising:
- a multi-layer substrate comprising:
- an upper side upon which the at least one thin-film resonator is arranged;
- outside electrodes;
- and
- at least one integrated passive or active circuit element to which the at least one thin-film resonator is electrically connected;
- the component further comprising:
- a carrier substrate upon which the at least one thin-film resonator is deposited, the at least one thin-film resonator being electrically connected with bond wires to the at least one circuit element integrated in the multi-layer substrate, the carrier substrate being arranged on an upper side of the multi-layer substrate, the carrier substrate being connected to the multi-layer substrate via a flip-chip technique;
- wherein the carrier substrate comprises a multi-layer structure.
9 more elements
A component working with acoustic bulk waves, comprising:
- at least one thin-film resonator, comprising:
- at least one piezoelectric layer and
- at least two electrodes applied in layers;
- the component further comprising:
- a multi-layer substrate comprising:
- an upper side upon which the at least one thin-film resonator is arranged;
- outside electrodes;
- and
- at least one integrated passive or active circuit element to which the at least one thin-film resonator is electrically connected;
- wherein a plurality of circuit elements integrated in the multi-layer substrate form a part of a duplexer circuit.
7 more elements
Dependencies are inferred from the claim text.