Method for probing a semiconductor wafer
AssigneeLSI Logic Corporation
InventorMargaret S. Fyfield
Life of this patent
Estimating the term…
Abstract
A semiconductor wafer is placed into a probe fixture with a front side of the wafer facing up. Power and signal probes are then placed on an integrated circuit (IC) formed on the front side of the wafer. The probe fixture is retained at a test station either in a upright or an inverted position for testing and optical failure analysis. The probe fixture includes a position adjustment mechanism to locate the entire probe above the wafer and to more precisely position a tip of the probe on the IC. Optical failure analysis techniques are performed on the front side or the back side of the wafer while the wafer is retained in the test fixture and the probes are connected to the IC.
Claims15
A method for probing a semiconductor wafer having a front side on which an integrated circuit (IC) is formed and a back side opposite the front side, comprising the steps of:
- placing the wafer onto a probe fixture;
- retaining the wafer to the probe fixture in a position in which the front side of the wafer is initially facing up;
- extending a probe tip of at least one probe from the probe fixture into contact with a contact point of the IC while the wafer is retained in the probe fixture;
- and
- optically examining the IC retained to the probe fixture.
A method for probing a semiconductor wafer having a front side on which an integrated circuit (IC) is formed and a back side opposite the front side, comprising the steps of:
- placing the wafer onto a probe fixture;
- retaining the wafer in a recess of the probe fixture in a position in which the front side of the wafer is initially facing up;
- extending a probe tip of at least one probe from the probe fixture into contact with a contact point of the IC while the wafer is retained in the probe fixture;
- optically examining the IC retained to the probe fixture;
- and
- applying one of reduced pressure or vacuum to the wafer to retain the wafer in the recess.
A method for probing a semiconductor wafer having a front side on which an integrated circuit (IC) is formed and a back side opposite the front side, comprising the steps of:
- placing the wafer onto a probe fixture;
- retaining the wafer to the probe fixture in a position in which the front side of the wafer is initially facing up;
- extending a probe tip of at least one probe from the probe fixture into contact with a contact point of the IC while the wafer is retained in the probe fixture;
- optically examining the IC retained to the probe fixture;
- extending a rail across and above the wafer retained in the probe fixture;
- and
- supporting the entire probe from the rail above the wafer when the probe tip extends into contact with a contact surface of the IC.
Dependencies are inferred from the claim text.