US 6,923,442 B2Granted

Die capable of being opened, manufacturing method thereof, and mold

AssigneeKonami Corporation

InventorsShoji Dewa, Akihiro Takatoku

Life of this patent

Estimating the term…

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Abstract

In a die which has a regular polyhedron form and which can be opened into a continuous polygonal form on a plane, boundary areas (Rb) between planes (11 through 16) on the inner side of the regular polyhedron have inclination angles determined according to the regular polyhedron. In addition, engaging portions (21a, 21b, 24a, 24b, 25a, 25b, 26a, 26b) not exceeding the respective boundary areas (Rb) are placed on the boundary areas (Rb) of predetermined planes (11 through 16). Such a die is formed by injecting plastic resin within a mold (31, 32) according to the form of the opened die. This realizes a three-dimensional die capable of being opened onto a two-dimensional plane, which has only been fictionally conceived, and further provides a manufacturing method thereof.

Claims4

Dependent claims

A mold for manufacturing a die, said die being configured as a polyhedron having multiple planes of similar shapes, which can be opened into a contiguous and planar polygonal area, each of the multiple planes having inclined boundary areas on one side, the multiple planes being contiguous to one another through bridge portions connected between two adjacent ones of the multiple planes, said mold having the form of said opened polyhedron and comprising:

a first mold portion that corresponds to said opened polyhedron and has a predetermined spacing in a thickness direction,
a plurality of second mold portions that correspond to said inclined boundary areas of said polyhedron and have spacing narrower than said predetermined spacing,
a third mold portion that corresponds to an inclined boundary portion of said die that is narrower in width as compared with the remaining boundary areas, and
a plurality of fourth mold portions that correspond to the bridge portions of said die.

1 more element

Dependencies are inferred from the claim text.

Facts

Application: 10/281,216Filed 28 Oct 2002 · division
Priority: JP 2000-4093618 Feb 2000
Published: US 2003/0094755 A122 May 2003
Granted: 2 Aug 2005
Term ends: Not estimatedThe source records don’t support an estimate.

Classification4 codes

A63F 9/0413
Dice; Dice-boxes; Mechanical dice-throwing devices: cuboid dice
A63F 2009/0497
Dice; Dice-boxes; Mechanical dice-throwing devices: manufacturing of dice
A63F 2250/484
With holes or fingers, e.g. blind hole: adapted for fingernail
A63F
Card, board, or roulette games

Family

Application09/785,325Parent of this division · filed 20 Feb 2001
US 2003/0094755 A1Pre-grant publication · published 22 May 2003
US 6,659,459 B2Parent of this division
US 2001/0015526 A1Published application
US 6,923,442 B2This patent

From the US filing history. Foreign family members aren’t listed.