Polyimide resin with reduced mold deposit
AssigneeGeneral Electric Company
InventorsRobert R Gallucci, Roy Ray Odle, William A. Kernick, III, Mark Alan Sanner
Life of this patent
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Abstract
A polyimide composition and a process to prepare polyimide resins with reduced plate out and mold deposits is described. During resin molding operations the low plate out resins show a longer period of operation between cleaning of equipment leading to more efficient operation.
Claims54
A process to prepare a polyimide comprising structural units of the formula
- wherein “a” has a value of greater than 1, V is a tetravalent linker, and R is a substituted or unsubstituted divalent organic radical,
- which process comprises reacting an organic diamine monomer having a molecular weight from 100 to 500 with an aromatic dianhydride monomer with a molecular weight from 218 to 1000 wherein the molecular weight of the polyetherimide is controlled by addition of an aromatic monoamine capping agent of molecular weight 93 to 250;
- wherein said polyimide comprises less than 5 wt. % of impurities based on the weight of the polyimide, said impurities having a molecular weight of less than about 500 daltons and comprising structural units derived from at least one monomer unit or from at least one aromatic monoamine.
A process to prepare a polyetherimide comprising structural units of the formula
- wherein T is —O— or a group of the formula —O—Z—O— wherein the divalent bonds of the —O— or the —O—Z—O— group are in the 3,3′, 3,4′, 4,3′, or the 4,4′ positions, and wherein Z is a divalent aromatic group selected from the group consisting of the formulas:
- and mixtures thereof,
- which process comprises reacting an organic diamine monomer having a molecular weight from 100 to 500 with an aromatic dianhydride monomer, wherein the molecular weight of the polyetherimide is controlled by addition of an aromatic monoamine capping agent of molecular weight 93 to 250,
- wherein said polyetherimide comprises less than 5 wt. % of impurities based on the weight of the polyetherimide, said impurities having a molecular weight of less than about 500 daltons and comprising structural units derived from at least one monomer unit or from at least one aromatic monoamine.
A polyimide composition comprising structural units of the formula
- wherein “a” has a value of greater than 1, V is a tetravalent linker, and R is a substituted or unsubstituted divalent organic radical,
- said structural units being derived from an organic diamine monomer having a molecular weight from 100 to 500 and an aromatic dianhydride monomer with a molecular weight from 218 to 1000, said polyimide further comprising structural units derived from an aromatic monoamine capping agent of molecular weight 93 to 250;
- wherein said polyimide comprises less than 5 wt. % of impurities based on the weight of the polyimide, said impurities having a molecular weight of less than about 500 daltons and comprising structural units derived from at least one monomer unit or from at least one aromatic monoamine.
A polyetherimide comprising structural units of the formula
- wherein T is —O— or a group of the formula —O—Z—O— wherein the divalent bonds of the —O— or the —O—Z—O— group are in the 3,3′, 3,4′, 4,3′, or the 4,4′ positions, and wherein Z is a divalent aromatic group selected from the group consisting of the formulas:
- and mixtures thereof,
- which comprises structural units derived from an organic diamine monomer having a molecular weight from 100 to 500 with an aromatic dianhydride monomer, wherein the molecular weight of the polyetherimide is controlled by addition of an aromatic monoamine capping agent of molecular weight 93 to 250,
- wherein said polyetherimide comprises less than 5 wt. % of impurities based on the weight of the polyetherimide, said impurities having a molecular weight of less than about 500 daltons and comprising structural units derived from at least one monomer unit or from at least one aromatic monoamine.
Dependencies are inferred from the claim text.