Thermally reworkable epoxy resins and compositions based thereon
AssigneeHenkel Corporation
InventorsJohn G. Woods, Susanne D. Morrill
Life of this patent
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Abstract
The present invention discloses reworkable epoxy compositions suitable for encapsulation of and underfill for electronic components including (a) the epoxidized reaction product of a multifunctional 1-alkenyl ether or 1-cycloalkenyl ether and an alkenyl carboxylic acid, the epoxidized reaction product having two or more thermally labile alpha-alkoxy ester linkages; and (b) a curing agent for the epoxy component. The epoxy composition, when cured, provides a composition which is thermally reworkable, the weak α-alkoxy ester linkages providing for the reworkable aspect of the invention.
Claims8
An epoxy composition comprising the epoxidized reaction product of a multifunctional 1-alkenyl or 1-cycloalkenyl ether and an alkenyl carboxylic acid, said epoxidized reaction product having two or more thermally labile alpha-alkoxy ester linkages.
A method for synthesizing an epoxy monomer comprising the steps of (a) reacting a 1-alkenyl or 1-cycloalkenyl ether with an alkenyl carboxylic acid at a ratio of at least 1 equivalent of n-functional 1-alkenyl or 1-cycloalkenyl ether per n equivalents of mono-alkenyl carboxylic acid, where n is an integer within the range of 1-6, to form an intermediate;
- and (b) epoxidizing the carbon-carbon double bonds of the intermediate formed in step (a).
A method of assembling an electronic component comprising applying a reworkable epoxy composition comprising the epoxidized reaction product of a multifunctional 1-alkenyl or 1-cycloalkenyl ether and an alkenyl carboxylic acid to a surface of an electronic component, and permitting said composition to cure.
Dependencies are inferred from the claim text.