Method of supplying slurry and a slurry supply apparatus having a mixing unit at a point of use

A method of circulating and dispensing a solution onto a surface of semiconductor wafer, comprising:

• introducing a first solution to a storage tank;
• pumping and circulating the first solution through a circulation loop between the storage tank and an in-line mixing unit, the in-line mixing unit having a dispensing conduit and a first solution flow control valve;
• controlling, via the first solution flow control valve, the flow of the first solution from the storage tank;
• controlling the first solution flow control valve via a controller;
• introducing a second solution to an additive tank;
• pumping and circulating the second solution through a circulation loop between the additive tank and the in-line mixing unit, the in-line mixing unit having a second solution flow control valve;
• controlling, via the second solution flow control valve, the flow of the second solution from the additive tank;
• controlling the second solution flow control valve via the controller;
• introducing, in response to a signal from the controller, the second solution to the in-line mixing unit via the second solution flow control valve, and mixing, via the in-line mixing unit, the second solution with the first solution to form a first mixed solution;
• and
• dispensing, via the in-line mixing unit, the first mixed solution onto the surface of the semiconductor wafer through the dispensing conduit.

A method of circulating and dispensing a solution onto a surface of a semiconductor wafer, comprising:

• introducing a first solution to a storage tank;
• pumping and circulating the first solution through a circulation loop between the storage tank and an in-line mixing unit, the in-line mixing unit having a dispensing conduit and a first solution flow control valve;
• controlling, via the first solution flow control valve, the flow of the first solution from the storage tank;
• controlling the first solution flow control valve via a controller;
• and
• introducing a second solution to an additive tank;
• pumping and circulating the second solution through circulation loop between the additive tank and the in-line mixing unit, the in-line mixing unit having a second solution flow control valve;
• controlling, via the second solution flow control valve, the flow of the second solution from the additive tank;
• controlling the second solution flow control valve via the controller;
• introducing, in response to a first signal from the controller, the second solution to the in-line mixing unit via the second solution flow control valve, and mixing, via the in-line mixing unit, the second solution with the first solution to form a first mixed solution;
• and
• introducing, in response to a second signal from the controller, a third solution to the in-line mixing unit via a third solution flow control valve and mixing, via the in-line mixing unit, the third solution with the first and second solutions to form a second mixed solution;
• and
• dispensing the second mixed solution onto the surface of the semiconductor wafer through the dispensing conduit.

A method of circulating and dispensing a solution onto a surface of a semiconductor wafer, comprising:

• introducing a first solution to a storage tank having a circulation loop for pumping and circulating the first solution;
• pumping the first solution from the storage tank to a mixing tank to create a first mixed solution;
• pumping and circulating the first mixed solution between the mixing tank and an in-line mixing unit, the in-line mixing unit having a dispensing conduit and at least one flow control valve;
• controlling, via the flow control valve, the flow of the first mixed solution from the mixing tank;
• controlling the flow control valve via a controller;
• introducing a second solution to an additive tank;
• pumping and circulating the second solution through a circulation loop between the additive tank and the in-line mixing unit, the in-line mixing unit having a second solution flow control valve;
• controlling, via the second solution flow control valve, the flow of the second solution from the additive tank;
• controlling the second solution flow control valve via the controller;
• introducing, in response to a signal from the controller, the second solution to the in-line mixing unit via the second solution flow control valve and mixing, via the in-line mixing unit, the second solution with the first mixed solution to form a second mixed solution;
• and
• dispensing, via the in-line mixing unit, the second mixed solution onto the surface of the semiconductor wafer through the dispensing conduit.

A method of circulating and dispensing a solution onto a surface of a semiconductor wafer, comprising:

• introducing a first solution to a storage tank having a circulation loop for circulating the first solution;
• pumping the first solution from the storage tank to a mixing tank to create a first mixed solution;
• pumping the first mixed solution from the mixing tank to a supply tank;
• pumping and circulating the first mixed solution between the supply tank and an in-line mixing unit, the in-line mixing unit having a dispensing conduit and at least one solution flow control valve;
• controlling, via the solution flow control valve, the flow of the first mixed solution from the supply tank;
• controlling the solution flow control valve via a controller;
• and
• dispensing, via the in-line mixing unit, the first mixed solution onto the surface of the semiconductor wafer through the dispensing conduit in response to a signal from the controller.

A method of circulating and dispensing a solution onto a surface of a semiconductor wafer, comprising:

• introducing a first solution to a storage tank having a circulation loop for circulating the first solution;
• pumping the first solution from the storage tank to a mixing tank to create a first mixed solution;
• pumping the first mixed solution from the mixing tank to a supply tank;
• pumping and circulating the first mixed solution between the supply tank and an in-line mixing unit, the in-line mixing unit having a dispensing conduit and at least one solution flow control valve;
• controlling, via the solution flow control valve, the flow of the first mixed solution from the supply tank;
• controlling the solution flow control valve via a controller;
• introducing a second solution to an additive tank;
• pumping and circulating the second solution through a circulation loop between the additive tank and the in-line mixing unit, the in-line mixing system having a second solution flow control valve;
• controlling, via the second solution flow control valve, the flow of the second solution from the additive tank;
• controlling the second solution flow control valve via the controller;
• introducing, in response to a signal from the controller, the second solution to the in-line mixing unit by the second solution flow control valve and mixing the second solution with the first mixed solution by the in-line mixing unit to form a second mixed solution;
• and
• dispensing, via the in-line mixing unit, the second mixed solution onto the surface of the semiconductor wafer through the dispensing conduit.

A system for circulating and dispensing a solution onto a surface of a semiconductor wafer, comprising:

• a storage tank having a first circulation loop for circulating a first solution between the storage tank and an in-line mixing unit, the in-line mixing unit having a dispensing conduit;
• and
• an additive tank having a second circulation loop for circulating a second solution between the additive tank and the in-line mixing unit,
• whereby the in-line mixing unit dispenses a first mixed solution comprising the first and second solutions onto the surface of the semiconductor wafer through the dispensing conduit in response to a signal from a controller.

A system for circulating and dispensing a solution onto a surface of a semiconductor wafer, comprising:

• a storage tank having a circulation loop for circulating a first solution;
• a mixing tank for creating a first mixed solution from the first solution and a second solution, and having a first circulation loop to circulate the first mixed solution between the mixing tank and an in-line mixing unit, the in-line mixing unit having a dispensing conduit;
• an additive tank having a second circulating line to circulate a third solution between the additive tank and the in-line mixing unit,
• whereby the in-line mixing unit dispenses a second mixed solution comprising the first mixed solution and a third solution onto the surface of the semiconductor wafer through the dispensing conduit in response to a signal from a controller.

A system for circulating and dispensing a solution onto a surface of a semiconductor wafer, comprising:

• a storage tank having a circulation loop for circulating a first solution;
• a mixing tank for creating a first mixed solution from the first solution and a second solution;
• a supply tank for receiving the first mixed solution from the mixing tank and having a first circulating loop to circulate the first mixed solution between the mixing tank and an in-line mixing unit, the in-line mixing unit having a dispensing unit;
• an additive tank having a second circulating line for circulating a third solution from the additive tank to the in-line mixing unit,
• whereby the in-line mixing unit dispenses a second mixed solution comprising the first mixed solution and a third solution onto the surface of the semiconductor wafer through the dispensing conduit in response to a signal from a controller.

A method of circulating and dispensing a solution onto a surface of a semiconductor wafer, comprising:

• introducing a first solution to a storage tank;
• pumping and circulating the first solution through a first circulation loop between the storage tank and an in-line mixing unit, the in-line mixing unit having a dispensing conduit;
• introducing a second solution to a additive tank;
• pumping and circulating the second solution through a second circulation loop between the additive tank and the in-line mixing unit;
• mixing, via the in-line mixing unit, the second solution with the first solution to form a mixed solution;
• and
• dispensing, via the in-line mixing unit, the mixed solution onto the surface of the semiconductor wafer through the dispensing conduit.

A method of circulating and dispensing a solution onto a surface of a semiconductor wafer, comprising:

• introducing a first solution to a storage tank having a first circulation loop for pumping and circulating the first solution;
• pumping the first solution from the storage tank to a mixing tank to create a first mixed solution;
• pumping and circulating the first mixed solution between the mixing tank and an in-line mixing unit, the in-line mixing unit having a dispensing conduit;
• introducing a second solution to an additive tank;
• pumping and circulating the second solution through a second circulation loop between the additive tank and the in-line mixing unit;
• mixin, via the in-line mixing unit, the second solution with the first mixed solution to form a second mixed solution;
• and
• dispensing, via the in-line mixing unit, the second mixed solution onto the surface of the semiconductor wafer through the dispensing conduit.

A method of circulating and dispensing a solution onto a surface of a semiconductor wafer, comprising:

• introducing a first solution to a storage tank having a first circulation loop for circulating the first solution;
• pumping the first solution from the storage tank to a mixing tank to create a first mixed solution;
• pumping the first mixed solution from the mixing tank to a supply tank;
• pumping and circulating the first mixed solution between the supply tank and an in-line mixing unit, the in-line mixing unit having a dispensing conduit;
• introducing a second solution to an additive tank;
• pumping and circulating the second solution through a second circulation loop between the additive tank and the in-line mixing unit;
• mixing the second solution with the first mixed solution by the in-line mixing unit to form a second mixed solution;
• and
• dispensing, via the in-line mixing unit, the second mixed solution onto the surface of the semiconductor wafer through the dispensing conduit.